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Specialized JEDEC IC Trays For Wafer Level Packaging & Clean IC Protection
Specialized JEDEC IC Trays perfectly fit semiconductor wafer level packaging production. They adapt well to high-standard cleanroom environments, and effectively reduce dust contamination to protect chip integrity.
Ultra-low particle generation performance keeps inner working conditions clean. They maintain stable performance for IC components during whole wafer processing procedures.
Reliable ESD anti-static protection is equipped for daily use. Custom cavity designs are also available, making them ideal choices for cleanroom wafer level packaging work.
Key Features/ Benefits
Ultra Low Particle Generation
Cleanroom Wafer Level Compatibility
Stable ESD Anti-Static Protection
Custom Cavity Pocket
Design Reliable IC Chip Protection
Specifications
Brand
Hiner-pack
Model
HN24227
Material
PPE
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×10.6 mm
Cavity Size
20.36x3.3x1.89 mm
Matrix QTY
11x14=264 PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
JEDEC trays offer complete chip protection throughout semiconductor manufacturing and transportation processes. They are highly suitable for ESD-sensitive semiconductor devices used in strict cleanroom environments.
JEDEC trays are widely applied to wafer-level packaging processing, cleanroom chip handling operations and daily production in semiconductor manufacturing factories.
Wafer-level packaging
Ultra Low Particle Generation
Cleanroom Wafer Level Compatibility
Stable ESD Anti-Static Protection
Custom Cavity Pocket Design
High Reliable Chip Protection
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
