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High Capacity JEDEC IC Trays for Semiconductor Modules
High Capacity JEDEC IC Trays are perfectly built for large semiconductor modules. High Capacity JEDEC IC Trays well fit big and thick semiconductor devices, and offer steady and secure placement to keep components in good condition.
High Capacity JEDEC IC Trays come with practical deep cavity design and strong solid structure. High Capacity JEDEC IC Trays deliver stable reliable support for large parts during daily production and handling work.
High Capacity JEDEC IC Trays greatly protect modules from damage in transportation. Custom pocket designs are also provided, bringing flexible practical choices for semiconductor module processing needs.
Key Features/ Benefits
PPE Anti-Static Material Protection
Deep Cavity Design for Large Modules
Strong Stable Structural Support
Effective Transport Damage Prevention
Customizable Pocket Cavity Design
Secure Placement for Thick Devices
Specifications
Brand
Hiner-pack
Model
HN24225
Material
PPE
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×10.6 mm
Cavity Size
48.5x45.5 mm
Matrix QTY
2x5=10 PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
High Capacity JEDEC IC Trays adopt PPE anti-static material. Trays offer reliable IC protection in manufacturing and transport, especially for ESD-sensitive semiconductor devices.
Power semiconductor modules
Industrial control IC components
Large & thick semiconductor devices
Module packaging, storage and transportation
Packaging & Shipping/ Services
High Capacity JEDEC IC Trays adopt high-quality durable PPE anti-static material for inner packaging. Trays support stable safe stacking and come with buffer protection designs to avoid damage during transportation.
Customized cavity packaging solutions are available for large semiconductor modules. All products are delivered by reliable logistics with full shipment tracking, ensuring safe worldwide delivery.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
