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4-inch Waffle Pack Lid / Cover – Anti-Static Protective Cover for IC Waffle Trays
The 4-inch waffle pack lid / cover is designed to securely protect semiconductor devices stored in waffle pack trays. It works together with standard 4-inch waffle pack trays to prevent device movement, contamination, and electrostatic damage during handling, storage, and transportation.
Manufactured from ESD-safe materials, the lid provides reliable electrostatic discharge protection while maintaining excellent dimensional stability. The cover fits precisely with standard waffle trays, ensuring stable stacking and secure closure during logistics and automated handling processes.
This waffle pack cover is widely used in semiconductor manufacturing, IC packaging, testing, and logistics, where reliable protection of sensitive electronic components is critical.
Key Features/ Benefits
ESD-safe material protects sensitive IC devices from electrostatic discharge
Precise fit designed for standard 4-inch waffle pack trays
Secure device retention prevents components from shifting during transport
Stackable design suitable for automated production lines
Reusable and durable for repeated use in semiconductor handling environments
It is suitable for protecting a wide range of IC packages such as QFN, BGA, QFP, SOP, and other semiconductor devices.
Advantages:
Using a waffle pack lid together with a waffle tray significantly improves device protection and operational efficiency. The cover helps maintain component alignment, reduces handling risks, and ensures safe transportation of sensitive semiconductor products.
The design is compatible with standard semiconductor packaging workflows, making it an essential accessory for IC handling systems.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...