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{"title":"Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile","imgUrl":"https:\/\/img.chinax.com\/nimg\/81\/18\/d6ca0a56f85ec5d78b71113cb5b1-200x200-1\/stackable_impact_resistant_conductive_waffle_pack_chip_trays_for_fragile.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24130","Place Of Origin":"China","Certification":"ISO 9001 ROHS SGS"}}
{"title":"Customized 2\u201dVCM IC Chip Tray die pack For Small Particle Chips","imgUrl":"https:\/\/img.chinax.com\/nimg\/ff\/28\/2cd9af5f383272180b78991a5c78-200x200-1\/customized_2_e2_80_9dvcm_ic_chip_tray_die_pack_for_small_particle_chips.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1845","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Loading Packaging IC Chip Tray 23.6x20.9mm High Temperature Resistant","imgUrl":"https:\/\/img.chinax.com\/nimg\/11\/02\/8cba1aba283494ac8b11574e1f88-200x200-1\/loading_packaging_ic_chip_tray_23_6x20_9mm_high_temperature_resistant.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1812","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Durable White Anti Static IC Chip Tray 6.0mm International Standards","imgUrl":"https:\/\/img.chinax.com\/nimg\/d4\/5f\/78b60148f704edf97ac7ec7f1bf8-200x200-1\/durable_white_anti_static_ic_chip_tray_6_0mm_international_standards.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN2064","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Black Plastic Waffle Pack Tray ESD 12PCS High Temperature Tray","imgUrl":"https:\/\/img.chinax.com\/nimg\/a3\/58\/0a4ea907fbda14fb4f44e57f5c97-200x200-1\/black_plastic_waffle_pack_tray_esd_12pcs_high_temperature_tray.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1884","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Shenzhen China"}}
{"title":"Environmental Protection IC Chip Tray Bare Die 2 Inch ESD Anti Static","imgUrl":"https:\/\/img.chinax.com\/nimg\/70\/60\/1a445895151abc9231873377845b-200x200-1\/environmental_protection_ic_chip_tray_bare_die_2_inch_esd_anti_static.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"NH20-28*23-10","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Eco Friendly PC Standard IC Chip Tray Anti Static For Lens Holder Series","imgUrl":"https:\/\/img.chinax.com\/nimg\/d0\/e5\/71ac118c4e7b5d57565eabfd142b-200x200-1\/eco_friendly_pc_standard_ic_chip_tray_anti_static_for_lens_holder_series.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"JEDEC standard tray 322.6*135.9*7.62&12.19mm","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
The "waffle" design is not merely a naming convention; the internal matrix of separator ribs functions as a high-precision structural grid that significantly increases the tray's mechanical rigidity. When multiple trays are stacked, these ribs align to create a series of reinforced vertical pillars, distributing external crushing forces across the entire stack rather than onto the fragile components within. Constructed from permanently conductive ABS or PC resins, these trays provide a dual layer of protection: safeguarding against electrostatic discharge (ESD) while providing a robust physical shield. By utilizing advanced Moldflow analysis, we ensure that the tray wall thickness and rib height are optimized for maximum strength-to-weight ratio. This ensures that your bare die, chip-scale packages (CSPs), and high-value 2.5D components remain securely seated and entirely isolated from external mechanical stress, ensuring they arrive at their destination in factory-perfect condition.
Key Features/ Benefits
Multi-Ribbed Structural Reinforcement
Impact-Absorbent Conductive Polymers
Permanent, Non-Degrading ESD Shielding
Precision Stackable Interlock System
Cleanroom-Compatible Purity
Specifications
Brand
Hiner-pack
Model
HN24130
Material
ABS
Tray Type
2-inch Waffle Pack
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.8x50.8x4mm
Cavity Size
1.75×1.2×0.35mm
Matrix QTY
10X10=100PCS
Warpage
MAX 0.2mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
This series is the industry standard for Cross-Border Semiconductor Distribution and secure component transit. Its primary applications include: International Shipping of Bare Die, where the risk of mechanical damage is highest; Logistics for High-Value Optoelectronics, providing a stable and crush-proof environment for fragile lenses; and Inter-Facility Component Transfer, where trays are moved between different manufacturing and testing sites. The robust design also makes them suitable for Field Service and Repair Kits, where replacement micro-parts must be carried safely in uncontrolled environments. Because they utilize the unofficial industry-standard 2-inch footprint, they integrate seamlessly into all global microelectronic supply chains, compatible with existing covers, clips, and automated handling interfaces.
Customization
We provide specialized engineering services to optimize our trays for your specific logistics challenges. Customization options include Reinforced External Wall Thickness for even higher crush resistance and Tailored Pocket Depths to accommodate thicker components while maintaining stack stability. Our team can also design Custom Stacking Configurations and specialized covers for non-standard heights. We offer a variety of material grades, including specific conductive colors for easy shipment identification. With a library of existing designs, we can rapidly find a structural match for your components, or we can develop a completely new mold in as little as 3 to 4 weeks, ensuring your global shipping needs are met with a precision-engineered solution.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
