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{"title":"Environmental Protection IC Chip Tray Bare Die 2 Inch ESD Anti Static","imgUrl":"https:\/\/img.chinax.com\/nimg\/70\/60\/1a445895151abc9231873377845b-200x200-1\/environmental_protection_ic_chip_tray_bare_die_2_inch_esd_anti_static.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"NH20-28*23-10","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Eco Friendly PC Standard IC Chip Tray Anti Static For Lens Holder Series","imgUrl":"https:\/\/img.chinax.com\/nimg\/d0\/e5\/71ac118c4e7b5d57565eabfd142b-200x200-1\/eco_friendly_pc_standard_ic_chip_tray_anti_static_for_lens_holder_series.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"JEDEC standard tray 322.6*135.9*7.62&12.19mm","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
Permanently Conductive RoHS Compliant Waffle Pack Chip Trays For Long Term Storage
In the semiconductor industry, the long-term reliability of a component is often dictated by the stability of its packaging material. This series of Permanently Conductive Waffle Pack Chip Trays is engineered with a focus on material science to provide a safe and stable environment for sensitive microelectronics. Unlike standard plastic trays that may lose their antistatic properties over time, our waffle packs are molded from carbon-fiber reinforced polymers or specialized conductive ABS/PC resins. This ensures that the electrostatic discharge (ESD) protection is an inherent part of the material structure, not just a surface treatment. The result is a tray that meets both ESD and RoHS environmental standards permanently. These traditional "waffle" format trays, typically 2 or 4 inches square, feature a regular pattern of separator ribs that create secure pockets for bare die, chip-scale packages (CSP), and flat 2.5D components.
Key Features/ Benefits
Permanent ESD Protection
Exceptional Dimensional Stability
RoHS and Environmental Compliance
Cleanroom Ready (Class 100-1000)
High Precision Flatness
Versatile Sizing and Material Grades
Specifications
Brand
Hiner-pack
Model
HN24092
Material
ABS
Tray Type
2-inch Waffle Pack
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.7x50.7x4mm
Cavity Size
2.03x2.03x0.38mm
Matrix QTY
16X16=250PCS
Warpage
MAX 0.2mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
These custom-engineered waffle packs are the ideal solution for non-standard microelectronic assembly and specialized component handling. Their primary applications include: Prototype Assembly of New Sensors, where the pocket must match a unique physical profile; Handling of Fragile Medical Micro-Parts, such as surgical implants or diagnostic sensors; and Secure Transport of Specialized Gems or Watch Components, where high-value items require individual, anti-crush compartments. They are also widely utilized in Engineering Lines transitioning to Automation, providing a consistent interface for custom tools. Because they adhere to the unofficial industry-standard 2-inch or 4-inch footprint, they remain compatible with existing waffle pack accessories like covers and clips while offering a completely bespoke internal environment.
Customization
We provide a comprehensive "design-from-scratch" service to meet your most challenging packaging needs. Customization options extend to Component Support Features, such as pedestals that lift the part to protect bottom-side features, or Reference Marks and Fiducials molded directly into the tray to aid machine vision systems. You can specify the Material Type (Conductive ABS, PC, or high-temp resins), Color-Coding for lot identification, and even Engraving for part numbers. Whether your part requires terminal isolation or specialized pad protection, our team can optimize the pocket geometry to ensure 100% alignment. For low-volume needs, we also offer CNC machining or 3D printing options, though molded trays remain the gold standard for high-precision, ESD-safe mass production.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
