Ecer asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
Your message must
be between 20-3,000 characters!
Submit Requirement
Thank You！
Your requirement has been sent. we will contact you quickly!
{"title":"Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And Clip Systems","imgUrl":"https:\/\/img.chinax.com\/nimg\/be\/7c\/8a63c32d184c866f680c6c2ce924-200x200-1\/stackable_2x2_inch_waffle_pack_chip_trays_with_secure_cover_and_clip_systems.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24094","Place Of Origin":"China","Certification":"ISO 9001 SGS ROHS"}}
{"title":"Customized 2\u201dVCM IC Chip Tray die pack For Small Particle Chips","imgUrl":"https:\/\/img.chinax.com\/nimg\/ff\/28\/2cd9af5f383272180b78991a5c78-200x200-1\/customized_2_e2_80_9dvcm_ic_chip_tray_die_pack_for_small_particle_chips.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1845","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Loading Packaging IC Chip Tray 23.6x20.9mm High Temperature Resistant","imgUrl":"https:\/\/img.chinax.com\/nimg\/11\/02\/8cba1aba283494ac8b11574e1f88-200x200-1\/loading_packaging_ic_chip_tray_23_6x20_9mm_high_temperature_resistant.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1812","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Durable White Anti Static IC Chip Tray 6.0mm International Standards","imgUrl":"https:\/\/img.chinax.com\/nimg\/d4\/5f\/78b60148f704edf97ac7ec7f1bf8-200x200-1\/durable_white_anti_static_ic_chip_tray_6_0mm_international_standards.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN2064","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Black Plastic Waffle Pack Tray ESD 12PCS High Temperature Tray","imgUrl":"https:\/\/img.chinax.com\/nimg\/a3\/58\/0a4ea907fbda14fb4f44e57f5c97-200x200-1\/black_plastic_waffle_pack_tray_esd_12pcs_high_temperature_tray.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1884","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Shenzhen China"}}
{"title":"Environmental Protection IC Chip Tray Bare Die 2 Inch ESD Anti Static","imgUrl":"https:\/\/img.chinax.com\/nimg\/70\/60\/1a445895151abc9231873377845b-200x200-1\/environmental_protection_ic_chip_tray_bare_die_2_inch_esd_anti_static.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"NH20-28*23-10","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Eco Friendly PC Standard IC Chip Tray Anti Static For Lens Holder Series","imgUrl":"https:\/\/img.chinax.com\/nimg\/d0\/e5\/71ac118c4e7b5d57565eabfd142b-200x200-1\/eco_friendly_pc_standard_ic_chip_tray_anti_static_for_lens_holder_series.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"JEDEC standard tray 322.6*135.9*7.62&12.19mm","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And Clip Systems
The Integrated Waffle Pack Packaging System from Hiner-pack represents a holistic approach to the secure storage and global distribution of sensitive microelectronic components. Recognizing that a tray is only as effective as the system that secures it, this product line focuses on the seamless synergy between the high-precision waffle pack chip tray, its corresponding covers, and specialized retention clips. Each 2 times 2 inch tray is engineered with a thin, space-saving profile that features a precision-molded pocket matrix for bare die and chip-scale packages (CSPs). This system is manufactured using electrically conductive or antistatic polymers (ABS/PC) that ensure permanent protection against electrostatic discharge throughout the entire stack. By utilizing advanced Moldflow analysis during the design phase, we ensure that the interlocking features of the trays and covers maintain a high degree of flatness and mechanical alignment, preventing components from migrating between pockets or being crushed during the rigors of international transit.
Key Features/ Benefits
Holistic Stackable Design
Complete Closure with Top Covers
Universal Clip System Compatibility
Permanent ESD and RoHS Integrity
High Precision and Flatness Control
Dust-Free Cleanroom Packaging
Specifications
Brand
Hiner-pack
Model
HN24094
Material
ABS
Tray Type
2-inch Waffle Pack
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.8x50.8x4mm
Cavity Size
4.95x2.2x1.16mm
Matrix QTY
14X7=98PCS
Warpage
MAX 0.2mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
This system-level solution is the standard for End-to-End Microelectronic Logistics. Its primary applications include: International Component Shipping, where the combination of stackable trays and clips provides the necessary durability for long-distance air and sea freight; Automated Tray Handling Systems, where the consistent dimensions and flatness of the stack allow for reliable machine gripping and feeding; and Cleanroom Inventory Management, providing an organized, dust-free method for storing large volumes of bare die or optical elements. It is also an ideal choice for Field Service Kits, where technicians require a compact and secure way to carry sensitive replacement parts. By offering a complete supply base of accessories, we ensure that our customers have a one-stop solution for managing their most fragile microelectronic assets from the production line to the final user.
Customization
Customization of the waffle pack system extends beyond the tray geometry to the entire packaging assembly. We can design Custom-Height Stacks and specialized covers that accommodate taller components or those with unique surface protrusions. Our engineering team can also provide Custom-Colored Trays and Covers for rapid visual identification of different product grades or process stages. Furthermore, we offer the ability to add Laser Engraving or Molded Identification Marks on both the trays and the covers for enhanced traceability. With existing designs, we can rapidly configure a "tray + cover" combination that meets your specific process requirements, often delivering custom-tooled solutions in as little as 3 to 4 weeks, ensuring your unique components are supported by a tried and true technology.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
