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{"title":"Environmental Protection IC Chip Tray Bare Die 2 Inch ESD Anti Static","imgUrl":"https:\/\/img.chinax.com\/nimg\/70\/60\/1a445895151abc9231873377845b-200x200-1\/environmental_protection_ic_chip_tray_bare_die_2_inch_esd_anti_static.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"NH20-28*23-10","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Eco Friendly PC Standard IC Chip Tray Anti Static For Lens Holder Series","imgUrl":"https:\/\/img.chinax.com\/nimg\/d0\/e5\/71ac118c4e7b5d57565eabfd142b-200x200-1\/eco_friendly_pc_standard_ic_chip_tray_anti_static_for_lens_holder_series.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"JEDEC standard tray 322.6*135.9*7.62&12.19mm","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
Permanent Antistatic 2 Inch Waffle Pack Chip Trays For R&D Prototyping And Batch Assembly
Waffle pack is positioned as a cost-effective, high-utility carrier ideal for research and development laboratories, engineering lines, and batch prototype assembly where initial costs and rapid deployment are prioritized. While maintaining the high quality and precision required for microelectronics, this tray focuses on the widely accepted 2×2 inch format, which is convenient for small, sensitive parts. It is constructed from a high-quality, permanent antistatic ABS material. This material provides essential ESD protection required for safely handling bare die and chip-scale packages (CSPs) without the higher cost associated with specialized bakeable or carbon-fiber reinforced materials, making it an excellent entry-point solution.
Key Features/ Benefits
Permanent Antistatic ABS Material
Ideal 2×2 Inch Compact Size
Rapid Turnaround Customization
Stackable and Secure Handling
Precision Molding for Alignment
Specifications
Brand
Hiner-pack
Model
HN24080
Material
ABS
Tray Type
2-inch Waffle Pack
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.7x50.7x4mm
Cavity Size
5.84x4.57x0.72mm
Matrix QTY
6x8=48PCS
Warpage
MAX 0.2mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
This waffle pack is primarily applied in the initial stages of the component lifecycle and in lower-volume processes. It is the perfect fit for: R&D Laboratory Use, providing a safe and organized way to manage and test small quantities of new semiconductor or optical designs; Prototype Assembly and Engineering Runs, enabling quick, safe handling of limited component batches before full production scaling; Manual Die Sorting and Inspection, where the tray's compact size and stable pockets facilitate easy manual manipulation and visual quality checks; and Internal Component Transfer, providing a low-cost, secure carrier for moving components between different workstations within a facility. Because many existing processes already utilize the waffle pack format, this tray offers an easy, low-risk entry point for new components moving into established workflows, making the transition seamless and budget-friendly.
Customization
Customization for the R&D focused tray emphasizes functionality and minimum non-recurring expenses (NRE). While the standard material is Antistatic ABS, we offer customization of: Specific Pocket Geometries tailored to protect critical features like terminal pads or lenses on prototype components; Color Coding using different antistatic resins to visually distinguish various component revisions or test lots; and Simplified Mold Designs optimized to reduce the NRE charge for entirely new custom geometries. We are also able to integrate basic alignment features like clearance cuts or tapered walls to accommodate early-stage, semi-automated pick-and-place trials. Our expertise allows us to provide custom-sized pockets and specific features without over-engineering the solution, keeping the focus on speed and cost-effectiveness for low-volume requirements.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
