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{"title":"Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices","imgUrl":"https:\/\/img.chinax.com\/nimg\/be\/7f\/629fda44894b042ec332afed0539-200x200-1\/black_mppo_esd_component_tray_7_62mm_thick_for_bga_ic_devices.jpg","attrs":{"Material":"MPPO","Color":"Black","Temperature":"125\u00b0C","Property":"ESD, Non-ESD"}}
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Anti-static JEDEC Matrix Trays For IC Components With Injection Molding
JEDEC (Joint Electronic Device Engineering Council) creates open standards for the microelectronics industry, ensuring product interoperability, benefiting the industry and ultimately consumers by reducing product development time and costs while increasing efficiency and productivity.
The maximum baking temperature is stamped into JEDEC trays. Exceeding the stated maximum baking temperature will cause the dimensions of the tray to alter; thus, potentially damaging the contents. The type of molding compound used during the tray's manufacture determines the tray's maximum temperature rating. Multiple compounds and/or powders are mixed together during the molding process to add specific features such as color, ESD properties, dimensional stability and maximum temperature ratings.
Key Features/ Benefits
Excellent humidity resistance up to 90% for component protection
Customizable black lids with UV protection
Matrix tray design
Automated handling compatible
ESD-safe plastic
Specifications
Brand
Hiner-pack
Model
HN24117
Material
MPPO
Package Type
IC Component
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×7.62 mm
Cavity Size
10x6.45x2.6 mm
Matrix QTY
4×7=28PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
Production line handling
IC processing
Cleanroom and outdoor storage scenarios
Semiconductor manufacturing
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...