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Customized Service JEDEC IC Tray Compatible Reusable for Electronic Assembly
Designed specifically for electronic assembly and repair applications, these JEDEC IC Trays provide essential protection for sensitive semiconductor devices during storage, transportation, and handling.
Manufactured using high-quality recyclable plastic materials, these trays offer excellent protection for electronic components while supporting environmental sustainability through fully recyclable construction. The commitment to eco-friendly production ensures responsible manufacturing practices without compromising quality or performance.
Key Features/ Benefits
Made from recyclable plastic materials, environmentally friendly and recyclable
Designed to hold various IC Types including BGA, QFP, QFN, LGA, and PGA
Customizable black lids with UV protection
deal for use alongside Cardboard Box Trays for enhanced storage and transport
Robust construction with minimal warpage (less than 0.76mm)
Specifications
Brand
Hiner-pack
Model
HN24173
Material
MPPO
Package Type
IC tray
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×7.62 mm
Cavity Size
18.11x16.33x1.26 mm
Matrix QTY
12×5=60PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
Electronics manufacturing and assembly lines
For efficient and safe handling, storage, and transportation of various integrated circuit (IC) types including BGA, QFP, QFN, LGA, and PGA
For securable handling and stacking
For different semiconductor packaging needs
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
