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{"title":"Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices","imgUrl":"https:\/\/img.chinax.com\/nimg\/be\/7f\/629fda44894b042ec332afed0539-200x200-1\/black_mppo_esd_component_tray_7_62mm_thick_for_bga_ic_devices.jpg","attrs":{"Material":"MPPO","Color":"Black","Temperature":"125\u00b0C","Property":"ESD, Non-ESD"}}
{"title":"Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material","imgUrl":"https:\/\/img.chinax.com\/nimg\/05\/5b\/d61e0c55086aef06bffb1fb5a482-200x200-1\/customized_jedec_matrix_trays_loading_fbga_ic_esd_rohs_raw_material.jpg","attrs":{"Material":"PPE","Color":"Black","Temperature":"150\u00b0C","Property":"ESD"}}
Custom Pocket Design JEDEC Tray with ESD Protection and Reusable for IC Component Handling
This JEDEC tray meets standard footprint requirements while providing enhanced fit and protection, offering a customizable pocket design based on client IC profile. Ideal for specialized packaging and engineering evaluations.
Key Features/ Benefits
JEDEC standard outer dimensions
Custom pocket layout available
ESD protection
Stackable and reusable
Designed for specific IC packages
Specifications
Brand
Hiner-pack
Model
HN24133
Material
ESD-safe plastic
Tray Type
JEDEC custom tray
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×12.19 mm
Cavity Size
20.4x8.0x7.41 mm
Matrix QTY
9×11=99PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Certifications
RoHS, ISO
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
Prototype handling
Engineering evaluation
Store or transport
Protect sensors from mechanical damage
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...