Shenzhen Hiner Technology Co., Ltd.
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Color | Black |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Payment Terms | T/T |
| Reusable | Yes |
| Flatness | Less than 0.75mm |
| Mold Type | Injection |
| Capacity | 5X6＝30 PCS |
| Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular |
| Packing Level | Transport package |
| Cavity Size | 28×18.8×3.53 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Certification | ROHS, ISO |
| Model Number | HN25072 |
| Place of Origin | China |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Quality Assurance | Delivery Guarantee, Reliable Quality | Color | Black |
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Payment Terms | T/T |
| Reusable | Yes | Flatness | Less than 0.75mm |
| Mold Type | Injection | Capacity | 5X6＝30 PCS |
| Supply Ability | 2000PCS/Day | Tray Shape | Rectangular |
| Packing Level | Transport package | Cavity Size | 28×18.8×3.53 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Certification | ROHS, ISO |
| Model Number | HN25072 | Place of Origin | China |
| Brand Name | Hiner-pack |
Searching reliable carriers for sensitive semiconductor chips? JEDEC IC trays built for chip storage and transit. Withstand high working temperature, block dust and physical harm toward delicate electronic parts.
Fit varied chip models. Custom cavity layout acts as core service. Adjust dimension, cavity count and heat resistance to satisfy unique project requirements.
Work for semiconductor assembling, chip testing and component transit. Keep chips steady through high‑temperature processing. Deliver steady protection in full production flow.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 5X6＝30 PCS | ||
| Service | Accept OEM, ODM | ||
Support semiconductor chip testing and high‑temperature reflow production. Secure electronic parts within automated assembly lines.
Fit mass component transit and warehouse storage. Shield sensitive IC units for local and cross‑border shipment. Deliver custom solution for special chip specifications.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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