Shenzhen Hiner Technology Co., Ltd.
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Mold Type | Injection |
| Capacity | 5X6＝30 PCS |
| Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular |
| Packing Level | Transport package |
| Cavity Size | 28×18.8×3.53 mm |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Color | Black |
| Payment Terms | T/T |
| Reusable | Yes |
| Flatness | Less than 0.75mm |
| Place of Origin | China |
| Certification | ROHS, ISO |
| Brand Name | Hiner-pack |
| Model Number | HN25072 |
View Detail Information
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Product Specification
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Mold Type | Injection |
| Capacity | 5X6＝30 PCS | Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular | Packing Level | Transport package |
| Cavity Size | 28×18.8×3.53 mm | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Color | Black |
| Payment Terms | T/T | Reusable | Yes |
| Flatness | Less than 0.75mm | Place of Origin | China |
| Certification | ROHS, ISO | Brand Name | Hiner-pack |
| Model Number | HN25072 | ||
| High Light | JEDEC IC trays for semiconductor storage ，secure IC trays for component protection ，JEDEC trays for semiconductor handling | ||
Searching reliable carriers for sensitive semiconductor chips? JEDEC IC trays built for chip storage and transit. Withstand high working temperature, block dust and physical harm toward delicate electronic parts.
Fit varied chip models. Custom cavity layout acts as core service. Adjust dimension, cavity count and heat resistance to satisfy unique project requirements.
Work for semiconductor assembling, chip testing and component transit. Keep chips steady through high‑temperature processing. Deliver steady protection in full production flow.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 5X6＝30 PCS | ||
| Service | Accept OEM, ODM | ||
Support semiconductor chip testing and high‑temperature reflow production. Secure electronic parts within automated assembly lines.
Fit mass component transit and warehouse storage. Shield sensitive IC units for local and cross‑border shipment. Deliver custom solution for special chip specifications.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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