Shenzhen Hiner Technology Co., Ltd.
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Color | Black |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Payment Terms | T/T |
| Reusable | Yes |
| Flatness | Less than 0.76mm |
| Mold Type | Injection |
| Capacity | 5x6=30 PCS |
| Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular |
| Packing Level | Transport package |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Cavity Size | 44.19×18.71 mm |
| Certification | ROHS, ISO |
| Model Number | HN25069 |
| Brand Name | Hiner-pack |
| Place of Origin | China |
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Product Specification
| Quality Assurance | Delivery Guarantee, Reliable Quality | Color | Black |
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Payment Terms | T/T |
| Reusable | Yes | Flatness | Less than 0.76mm |
| Mold Type | Injection | Capacity | 5x6=30 PCS |
| Supply Ability | 2000PCS/Day | Tray Shape | Rectangular |
| Packing Level | Transport package | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Cavity Size | 44.19×18.71 mm | Certification | ROHS, ISO |
| Model Number | HN25069 | Brand Name | Hiner-pack |
| Place of Origin | China |
Carry sturdy grid cavity design to firmly hold semiconductor chips. Block dust scratches and impact across test transfer and shipment cycles. Search stable component holding solutions for production lines? Endure repeated heavy‑duty use and lower chip damage risks.
Offer reliable anti‑static performance to guard sensitive semiconductor parts. Keep chip surfaces clean through full handling procedures. Maintain stable output inside strict clean‑room manufacturing surroundings.
Support full custom cavity dimension and layout adjustment. Fit varied chip size requirements. Work with automated pick‑and‑place equipment to satisfy diverse semiconductor manufacturing demands.
Key Features/ Benefits
| Brand | Hiner-pack | ||
| Material | PC | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.5 mm | ||
| Matrix QTY | 5x6=30 PCS | ||
| Service | Accept OEM, ODM | ||
Fit semiconductor chip storage component testing and production transfer. Match automated pick‑and‑place machines and clean‑room environments. Support short‑term placement and long‑term chip preservation.
Serve semiconductor factories IC packaging workshops and component warehouses. Handle cross‑workshop production transfer and high‑precision component protection tasks.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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