Shenzhen Hiner Technology Co., Ltd.
| Cavity Size | 45×45×6.35 mm |
| Reusable | Yes |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Delivery Time | 10 workdays |
| Mold Type | Injection |
| Payment Terms | T/T |
| Color | Black |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Tray Shape | Rectangular |
| Packaging Details | CARTON, PALLET |
| Packing Level | Transport package |
| Flatness | Less than 0.76mm |
| Capacity | 2X6=12 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Model Number | HN25088 |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
| Place of Origin | China |
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Product Specification
| Cavity Size | 45×45×6.35 mm | Reusable | Yes |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Delivery Time | 10 workdays |
| Mold Type | Injection | Payment Terms | T/T |
| Color | Black | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Tray Shape | Rectangular |
| Packaging Details | CARTON, PALLET | Packing Level | Transport package |
| Flatness | Less than 0.76mm | Capacity | 2X6=12 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Model Number | HN25088 |
| Brand Name | Hiner-pack | Certification | ROHS, ISO |
| Place of Origin | China |
Offer flexible custom cavity solutions as core capability. Adjust cavity layout, cell size and outer outline to match varied chip forms. Accept development according to sample or drawing references for unique semiconductor projects.
Support automated production line operation. Hold delicate chips firmly inside precision slots. Maintain reliable protection covering component loading, manufacturing processing and finished goods outbound shipment.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×12.19 mm | ||
| Matrix QTY | 2X6=12 PCS | ||
| Service | Accept OEM, ODM | ||
Adapt to semiconductor chip packaging and high‑temp assembly lines. Firmly lock chips during automated processing to avoid shift and scratch damage.
Suit component stock storage and cross‑workshop transfer. Shield sensitive chips from dust and static risks. Take custom modification for non‑standard chip specifications.
Stack together with separating protective boards, then pack inside thick reinforced cartons. Lower scratch and collision hazards during domestic site handling.
Support sea, air and express delivery channels. Keep stable production lead‑time. Use strengthened outer package to cut breakage risk for long‑distance overseas shipment.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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