| Color | Black |
| Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular |
| Packing Level | Transport package |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Payment Terms | T/T |
| Reusable | Yes |
| Flatness | Less than 0.76mm |
| Mold Type | Injection |
| Capacity | 4×14=56 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Cavity Size | 25×16×2.25 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Model Number | HN25074 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Color | Black | Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular | Packing Level | Transport package |
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Payment Terms | T/T |
| Reusable | Yes | Flatness | Less than 0.76mm |
| Mold Type | Injection | Capacity | 4×14=56 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Cavity Size | 25×16×2.25 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Model Number | HN25074 |
| Certification | ROHS, ISO | Place of Origin | China |
| Brand Name | Hiner-pack |
Looking for reliable holders for delicate semiconductor chips? Built from robust PPE material, deliver solid protection during chip test and packaging. Stand up to high heat and block dust harm for sensitive electronic units.
Fit diverse chip specifications. Custom cavity design acts as core service. Adjust cavity layout, dimensions to satisfy varied semiconductor project demands.
Support full semiconductor production workflow. Keep chips stable in high‑temp working environment. Bring steady protection across testing assembling and component shipment.
| Brand | Hiner-pack | ||
| Material | PPE | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×9.35 mm | ||
| Matrix QTY | 4×14=56 PCS | ||
| Service | Accept OEM, ODM | ||
Suit semiconductor chip testing and high‑temperature production processes. Hold IC parts steady inside automated assembly lines.
Fit bulk component storage and cross‑border shipment. Protect sensitive semiconductor units. Accept special custom solutions for non‑standard chip models.
Stack neatly with protective separators inside thick cartons. Prevent bump and scratch during internal handling.
Support sea air and express delivery. Maintain stable lead time. Reinforced outer packing reduce risk for long‑distance global transport.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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