China factories

Chat Now Send Email
China factory - Shenzhen Hiner Technology Co., Ltd.

Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
  1. Home
  2. Products
  3. About Us
  4. Contact Us

Leave a Message

we will call you back quickly!

Submit Requirement
China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor
China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor

  1. China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor
  2. China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor
  3. China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor
  4. China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor
  5. China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor
  6. China Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor

Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Color Black
Supply Ability 2000PCS/Day
Tray Shape Rectangular
Packing Level Transport package
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Clean Class General And Ultrasonic Cleaning
Payment Terms T/T
Reusable Yes
Flatness Less than 0.76mm
Mold Type Injection
Capacity 4×14=56 PCS
Quality Assurance Delivery Guarantee, Reliable Quality
Cavity Size 25×16×2.25 mm
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Packaging Details CARTON, PALLET
Ic Type BGA,QFP,QFN,LGA,PGA
Model Number HN25074
Certification ROHS, ISO
Place of Origin China
Brand Name Hiner-pack

View Detail Information

Inquiry by Email Get Latest Price
Chat online Now Ask for best deal
  1. Product Details
  2. Company Details

Product Specification

Color Black Supply Ability 2000PCS/Day
Tray Shape Rectangular Packing Level Transport package
Delivery Time 10 workdays Incoterms EXW, FOB, CIF, DDU, DDP
Clean Class General And Ultrasonic Cleaning Payment Terms T/T
Reusable Yes Flatness Less than 0.76mm
Mold Type Injection Capacity 4×14=56 PCS
Quality Assurance Delivery Guarantee, Reliable Quality Cavity Size 25×16×2.25 mm
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Packaging Details CARTON, PALLET
Ic Type BGA,QFP,QFN,LGA,PGA Model Number HN25074
Certification ROHS, ISO Place of Origin China
Brand Name Hiner-pack
Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

Looking for reliable holders for delicate semiconductor chips? Built from robust PPE material, deliver solid protection during chip test and packaging. Stand up to high heat and block dust harm for sensitive electronic units.


Fit diverse chip specifications. Custom cavity design acts as core service. Adjust cavity layout, dimensions to satisfy varied semiconductor project demands.


Support full semiconductor production workflow. Keep chips stable in high‑temp working environment. Bring steady protection across testing assembling and component shipment.

Key Features/ Benefits 
  • Made of durable PPE raw material
  • Heat-proof and anti-contamination
  • Anti‑static performance guard IC components
  • More than 12 years of export experience.
  • With professional engineers and efficient management.
Specifications
Brand Hiner-pack
Model HN25074
Material  PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×9.35 mm
Cavity Size 25×16×2.25 mm
Matrix QTY 4×14=56 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Suit semiconductor chip testing and high‑temperature production processes. Hold IC parts steady inside automated assembly lines.


Fit bulk component storage and cross‑border shipment. Protect sensitive semiconductor units. Accept special custom solutions for non‑standard chip models.

Packaging & Shipping/ Services

Stack neatly with protective separators inside thick cartons. Prevent bump and scratch during internal handling.


Support sea air and express delivery. Maintain stable lead time. Reinforced outer packing reduce risk for long‑distance global transport.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement