Shenzhen Hiner Technology Co., Ltd.
| Cavity Size | 9.81×10.87×1.5 mm |
| Reusable | Yes |
| Delivery Time | 10 workdays |
| Mold Type | Injection |
| Payment Terms | T/T |
| Color | Black |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Clean Class | General And Ultrasonic Cleaning |
| Tray Shape | Rectangular |
| Packaging Details | CARTON, PALLET |
| Packing Level | Transport package |
| Flatness | Less than 0.76mm |
| Capacity | 3×5＝15 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Model Number | HN25081 |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
| Place of Origin | China |
View Detail Information
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Product Specification
| Cavity Size | 9.81×10.87×1.5 mm | Reusable | Yes |
| Delivery Time | 10 workdays | Mold Type | Injection |
| Payment Terms | T/T | Color | Black |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Clean Class | General And Ultrasonic Cleaning | Tray Shape | Rectangular |
| Packaging Details | CARTON, PALLET | Packing Level | Transport package |
| Flatness | Less than 0.76mm | Capacity | 3×5＝15 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Model Number | HN25081 |
| Brand Name | Hiner-pack | Certification | ROHS, ISO |
| Place of Origin | China |
Searching reliable protection for sensitive IC chips? Built from high‑grade PPE, withstand high‑temperature working conditions. Shield delicate semiconductor parts from scratch and contamination in daily operations.
Match multiple chip specifications. Custom cavity solution stands as core offer. Adjust cavity size and layout to satisfy different semiconductor project needs.
Fit whole semiconductor production flow. Keep IC components secure through testing, assembling and shipment. Bring consistent protection across various operating scenarios.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×9.35 mm | ||
| Matrix QTY | 3×5＝15 PCS | ||
| Service | Accept OEM, ODM | ||
Work for mass component storage and cross‑border transportation. Protect delicate semiconductor parts. Handle special requirements for non‑standard chip models.
Offer full custom for cavity dimension and layout. Modify overall tray size to fit unique chip samples. Accept drawing‑based development for special semiconductor projects.
Support sample confirmation before bulk order. Flexible adjust parameters to meet project targets. Deliver tailored solutions for diverse client demands.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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