Shenzhen Hiner Technology Co., Ltd.
| Cavity Size | 18.5×11.6×4.26 mm |
| Reusable | Yes |
| Payment Terms | T/T |
| Color | Black |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Delivery Time | 10 workdays |
| Mold Type | Injection |
| Clean Class | General And Ultrasonic Cleaning |
| Tray Shape | Rectangular |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Flatness | Less than 0.76mm |
| Capacity | 20x5=100 PCS |
| Model Number | HN25083 |
| Brand Name | Hiner-pack |
| Place of Origin | China |
| Certification | ROHS, ISO |
View Detail Information
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Product Specification
| Cavity Size | 18.5×11.6×4.26 mm | Reusable | Yes |
| Payment Terms | T/T | Color | Black |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Delivery Time | 10 workdays | Mold Type | Injection |
| Clean Class | General And Ultrasonic Cleaning | Tray Shape | Rectangular |
| Packaging Details | CARTON, PALLET | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package | Flatness | Less than 0.76mm |
| Capacity | 20x5=100 PCS | Model Number | HN25083 |
| Brand Name | Hiner-pack | Place of Origin | China |
| Certification | ROHS, ISO |
Constructed from high‑performance Mppo material, hold integrated circuit parts securely. Resist high operating heat and block outside contaminants. Maintain stable performance through repeated circulation inside semiconductor workshops.
Meet diverse chip layout requirements. Custom cavity development serves as core offering. Adjust cavity dimension, slot quantity and overall tray outline to match varied chip samples and project standards.
Fit mainstream semiconductor production workflows. Keep steady supporting performance for long‑time mass‑use. Bring consistent protection from component loading all the way to finished‑part outgoing shipment.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×9.5 mm | ||
| Matrix QTY | 20x5=100 PCS | ||
| Service | Accept OEM, ODM | ||
Suit semiconductor chip packaging and assembly workflows. Hold integrated circuit components steady during automated production operations.
Fit bulk component storage and inter‑workshop transit. Protect delicate chips against dust and scratch. Accept custom modification for special non‑standard chip types.
Get stacked with separating protective boards, then packed into thick carton cases. Lower scratch and collision risks during inner‑site handling.
Support sea, air and express delivery modes. Arrange stable production lead‑time. Adopt reinforced outer package to reduce damage risk for long‑distance overseas shipment.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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