Shenzhen Hiner Technology Co., Ltd.
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Color | Black |
| Supply Ability | 2000PCS/Day |
| Tray Shape | Rectangular |
| Packing Level | Transport package |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Payment Terms | T/T |
| Reusable | Yes |
| Flatness | Less than 0.76mm |
| Mold Type | Injection |
| Capacity | 13x5=65 PCS |
| Cavity Size | 19.45×22.42 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Certification | ROHS, ISO |
| Model Number | HN25068 |
| Place of Origin | China |
| Brand Name | Hiner-pack |
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Product Specification
| Quality Assurance | Delivery Guarantee, Reliable Quality | Color | Black |
| Supply Ability | 2000PCS/Day | Tray Shape | Rectangular |
| Packing Level | Transport package | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Clean Class | General And Ultrasonic Cleaning |
| Payment Terms | T/T | Reusable | Yes |
| Flatness | Less than 0.76mm | Mold Type | Injection |
| Capacity | 13x5=65 PCS | Cavity Size | 19.45×22.42 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Certification | ROHS, ISO |
| Model Number | HN25068 | Place of Origin | China |
| Brand Name | Hiner-pack |
Offer rigid grid cavity structures to firmly lock semiconductor chips in place. Prevent component shift and collision across test transfer and storage cycles. Seek reliable component holding solutions for production lines? Stand heavy‑duty repeated operations to cut chip damage risk.
Provide stable anti‑static performance to shield sensitive semiconductors from static harm. Keep chip surfaces clean throughout whole handling workflows. Stand consistent performance under long‑run clean‑room manufacturing conditions.
Support full custom cavity size depth and layout adjustments. Match diverse chip dimension requirements. Adapt automated pick‑and‑place equipment and multiple production scenarios to satisfy varied semiconductor manufacturing demands.
| Brand | Hiner-pack | ||
| Material | PC | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 13x5=65 PCS | ||
| Service | Accept OEM, ODM | ||
Fit semiconductor chip storage, production transfer and component testing. Work well with automated pick‑and‑place equipment and clean‑room environments. Serve short‑term placement and long‑term chip safekeeping.
Apply widely for semiconductor factories IC packaging workshops and component warehouses. Support on‑site production cross‑workshop transfer and high‑precision component preservation work.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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