Shenzhen Hiner Technology Co., Ltd.
| Reusable | Yes |
| Delivery Time | 10 workdays |
| Mold Type | Injection |
| Payment Terms | T/T |
| Color | Black |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET |
| Tray Shape | Rectangular |
| Cavity Size | 18×41.8×7.7 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Flatness | Less than 0.76mm |
| Capacity | 5X6=30 PCS |
| Packing Level | Transport package |
| Model Number | HN25089 |
| Brand Name | Hiner-pack |
| Place of Origin | China |
| Certification | ROHS, ISO |
View Detail Information
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Product Specification
| Reusable | Yes | Delivery Time | 10 workdays |
| Mold Type | Injection | Payment Terms | T/T |
| Color | Black | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET | Tray Shape | Rectangular |
| Cavity Size | 18×41.8×7.7 mm | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Flatness | Less than 0.76mm | Capacity | 5X6=30 PCS |
| Packing Level | Transport package | Model Number | HN25089 |
| Brand Name | Hiner-pack | Place of Origin | China |
| Certification | ROHS, ISO |
Constructed from high‑grade PPE raw material, sustain maximum 150℃ working temperature. Deliver stable anti‑static performance, keep away dust particles that damage sensitive chips. Stand repeated stacking and circulation inside semiconductor manufacturing workshops.
Focus on flexible cavity customization as core strength. Adjust slot shape, inner dimension and overall tray outline. Match diverse chip specifications, accept project development based on customer‑provided samples or technical drawings.
Fit automatic packaging and production workflows. Secure fragile chips firmly inside molded slots. Offer steady protection running from component loading, processing until finished‑product outbound delivery.
| Brand | Hiner-pack | ||
| Material | PPE | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×13.19 mm | ||
| Matrix QTY | 5X6=30 PCS | ||
| Service | Accept OEM, ODM | ||
Work for semiconductor chip packaging and high‑temperature assembly processes. Hold fragile chips steady during automated operations to avoid scratch and particle pollution.
Suitable for chip internal storage and inter‑workshop transit. Prevent dust and static harm to sensitive devices. Realize personalized modification for special non‑standard chip types.
Stack finished trays with protective separator boards, then pack into thickened carton boxes. Reduce scratch and collision risks during factory‑site handling and stock movement.
Support sea, air and express shipment modes. Maintain predictable production lead‑time. Apply reinforced outer package to lower damage risk for long‑distance overseas transportation.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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