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China factory - Shenzhen Hiner Technology Co., Ltd.

Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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  2. Waffle Pack Chip Trays>
  3. Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection

  1. China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
  2. China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
  3. China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
  4. China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
  5. China Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection

Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection

  1. MOQ： 1000
  2. Price： $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
  3. Get Latest Price
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Payment Terms T/T
Color Black
Cavity Size 1.08X0.75X0.25 mm
Outline Line Size 50.7×50.7×7.4 mm
Mold Type Injection
Capacity 22x19=418 PCS
Packing Level Transport package
Warpage Warpage MAX 0.26mm
Quality Assurance Delivery Guarantee, Reliable Quality
Ic Type BGA,QFP,QFN,LGA,PGA
Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Packaging Details CARTON, PALLET
Tray Shape Rectangular
Reusable Yes
Clean Class General And Ultrasonic Cleaning
Model Number HN25003
Certification ROHS, ISO
Brand Name Hiner-pack
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time 10 workdays Incoterms EXW, FOB, CIF, DDU, DDP
Payment Terms T/T Color Black
Cavity Size 1.08X0.75X0.25 mm Outline Line Size 50.7×50.7×7.4 mm
Mold Type Injection Capacity 22x19=418 PCS
Packing Level Transport package Warpage Warpage MAX 0.26mm
Quality Assurance Delivery Guarantee, Reliable Quality Ic Type BGA,QFP,QFN,LGA,PGA
Supply Ability 2000PCS/Day Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Packaging Details CARTON, PALLET Tray Shape Rectangular
Reusable Yes Clean Class General And Ultrasonic Cleaning
Model Number HN25003 Certification ROHS, ISO
Brand Name Hiner-pack Place of Origin China
High Light Heavy Duty Waffle Pack Chip Trays ，Waffle Pack Trays with Uniform Grid ，Fine Pitch IC Protection Trays
Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
Looking for dependable carriers to safeguard miniature semiconductor components?

Own abundant independent precision cavities to separate each chip. Avoid mutual collision and surface wear during testing, transfer and inventory arrangement.

Possess lasting conductive performance to resist static hazards. Fully adapt to long-cycle repeated operation inside electronic manufacturing workshops.

Adjust cavity layout and overall dimensions flexibly. Provide personalized storage solutions to satisfy diverse production requirements worldwide.
Key Features/ Benefits 
  • Steady conductive & anti-static capability
  • Durable industrial conductive plastic body
  • Stable component holding
  • Multiple independent precision cavities
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN25003
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.08X0.75X0.25 mm
Matrix QTY 22x19=418 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for storage and circulation of fine pitch ICs, micro semiconductors and tiny electronic parts. Isolate components to reduce mechanical damage and electrostatic risks.
 
Ideal for semiconductor factories, component vendors and SMT workshops to complete chip testing, production transfer and stock management work.
Packaging & Shipping/ Services
All goods are packed in reinforced export cartons with shockproof fillers. Internal fixation prevents sliding and extrusion. Uniform packing standards are implemented. Comprehensive pre-shipment inspection ensures safe delivery by sea or air transportation.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays

In-house mold design capability

Fast prototype development

Strict QC process

Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory

  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification：

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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