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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Waffle Pack Chip Trays made from anti static materials to ensure safe handling
China Waffle Pack Chip Trays made from anti static materials to ensure safe handling

  1. China Waffle Pack Chip Trays made from anti static materials to ensure safe handling
  2. China Waffle Pack Chip Trays made from anti static materials to ensure safe handling
  3. China Waffle Pack Chip Trays made from anti static materials to ensure safe handling
  4. China Waffle Pack Chip Trays made from anti static materials to ensure safe handling
  5. China Waffle Pack Chip Trays made from anti static materials to ensure safe handling

Waffle Pack Chip Trays made from anti static materials to ensure safe handling

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Payment Terms T/T
Color Black
Cavity Size 6.7X3.1X0.5 mm
Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Packing Level Transport package
Warpage Warpage MAX 0.22mm
Mold Type Injection
Capacity 5x10=50 PCS
Quality Assurance Delivery Guarantee, Reliable Quality
Outline Line Size 50.7×50.7×4 mm
Ic Type BGA,QFP,QFN,LGA,PGA
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning
Reusable Yes
Packaging Details CARTON, PALLET
Model Number HN25007
Certification ROHS, ISO
Place of Origin China
Brand Name Hiner-pack

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Color Black
Cavity Size 6.7X3.1X0.5 mm Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Packing Level Transport package
Warpage Warpage MAX 0.22mm Mold Type Injection
Capacity 5x10=50 PCS Quality Assurance Delivery Guarantee, Reliable Quality
Outline Line Size 50.7×50.7×4 mm Ic Type BGA,QFP,QFN,LGA,PGA
Delivery Time 10 workdays Incoterms EXW, FOB, CIF, DDU, DDP
Tray Shape Rectangular Clean Class General And Ultrasonic Cleaning
Reusable Yes Packaging Details CARTON, PALLET
Model Number HN25007 Certification ROHS, ISO
Place of Origin China Brand Name Hiner-pack
High Light anti static waffle pack chip trayssemiconductor IC chip storage trayssafe handling waffle pack trays
Anti-Static Waffle Trays for Secure Storage of Delicate Semiconductor IC Chips
Equipped with independent recessed pockets to hold electronic components separately. Cut down shifting, friction and surface damage throughout testing, handling and storage processes.

Maintain stable conductive properties to eliminate static threats. Adapt to continuous repeated operation inside electronics manufacturing environments.

Allow adjustments to pocket dimensions and overall outlines. Deliver targeted storage solutions to match different production and logistics requirements from electronics industries.
Key Features/ Benefits 
  • Stable conductive ESD performance
  • Independent separated pockets
  • Durable construction
  • Secure chip holding
  • Support custom specifications
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25007
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 6.7X3.1X0.5 mm
Matrix QTY 5x10=50  PCS
Warpage MAX 0.22mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Ideal for storing and transporting semiconductor devices and electronic components. Separate pocket design effectively avoids collision and electrostatic damage.
 
Suitable for semiconductor factories, electronics assembly plants and component distributors for testing, production transfer and inventory management.
Customized Services
Customization service is available to satisfy varied industrial requirements. Pocket dimensions and overall sizes can be developed as requests. Professional technical team supports project cooperation. Reach out to discuss tailored solutions for your production lines.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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