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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC
China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC

  1. China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC
  2. China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC
  3. China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC
  4. China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC
  5. China Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC

Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Payment Terms T/T
Color Black
Cavity Size 4.85X2.75X0.5 mm
Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Packing Level Transport package
Warpage Warpage MAX 0.26mm
Mold Type Injection
Capacity 11x7=77 PCS
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Quality Assurance Delivery Guarantee, Reliable Quality
Outline Line Size 50.7×50.7×4mm
Ic Type BGA,QFP,QFN,LGA,PGA
Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning
Reusable Yes
Packaging Details CARTON, PALLET
Model Number HN24240
Place of Origin China
Certification ROHS, ISO
Brand Name Hiner-pack

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Color Black
Cavity Size 4.85X2.75X0.5 mm Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Packing Level Transport package
Warpage Warpage MAX 0.26mm Mold Type Injection
Capacity 11x7=77 PCS Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP Quality Assurance Delivery Guarantee, Reliable Quality
Outline Line Size 50.7×50.7×4mm Ic Type BGA,QFP,QFN,LGA,PGA
Tray Shape Rectangular Clean Class General And Ultrasonic Cleaning
Reusable Yes Packaging Details CARTON, PALLET
Model Number HN24240 Place of Origin China
Certification ROHS, ISO Brand Name Hiner-pack
High Light durable waffle pack chip trayswaffle pack chip trays with uniform gridsfine pitch IC storage waffle trays
Durable Waffle Pack Chip Trays featuring Uniform Grids for Safe Fine Pitch IC Storage
Searching for reliable packaging to safeguard delicate fine pitch ICs?

Built with evenly spaced grid compartments to firmly lock components. Prevent chips from shifting and collision during handling, transit and storage.

Deliver steady anti-static performance to shield sensitive semiconductors. Fit repeated circulation inside electronic manufacturing workshops.

Support flexible structural adjustments to match diverse chip dimensions. Meet varied packaging demands across semiconductor and electronics industries.
Key Features/ Benefits 
  • Reliable ESD protection for sensitive semiconductor parts
  • Precise grid cavities for stable component holding
  • Stackable layout to save storage and shipping space
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24240
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4mm
Cavity Size 4.85X2.75X0.5 mm
Matrix QTY 11x7=77 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Perfect for storing and transporting integrated circuits, chips, sensors and other precision microelectronic components. Effectively guard fragile fine-pitch devices against static damage and physical abrasion in every workflow.
 
Widely adopted by semiconductor factories, electronic component suppliers and SMT assembly workshops. Suitable for chip inspection, production turnover, finished goods storage and cross-regional shipment of electronic parts.
Packaging & Shipping/ Services
Adopt scientific stacking method to avoid extrusion and deformation of trays. Outer carton packaging with buffer materials reduces impact risks during long-distance ocean and air freight.

Flexible packing quantity can be arranged according to your order scale. Strict packing standard ensures intact delivery. Stable packaging solution fits regular bulk shipments for global semiconductor buyers.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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