Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 10.2x4.2x0.45 mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.21mm |
| Mold Type | Injection |
| Capacity | 50.7×50.7×4 mm |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.7×50.7×4 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25013 |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Color | Black |
| Cavity Size | 10.2x4.2x0.45 mm | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packing Level | Transport package |
| Warpage | Warpage MAX 0.21mm | Mold Type | Injection |
| Capacity | 50.7×50.7×4 mm | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.7×50.7×4 mm | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Reusable | Yes | Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning | Packaging Details | CARTON, PALLET |
| Model Number | HN25013 | Brand Name | Hiner-pack |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | Heat-resistant waffle pack trays ，Anti-static semiconductor IC trays ，Waffle pack chip storage trays | ||
Block static discharge that damages delicate semiconductor components. Maintain stable shape under repeated high‑temperature process cycles. Searching for dependable carriers for precision IC units? Stand up to rigorous conditions inside high‑output production workshops.
Hold precision chips within engraved grid cavities. Prevent displacement and surface scratches during handling operations. Lower component rejection risks caused by static shock and physical impact. Deliver steady protective performance across full production sequences.
Endure repeated stacking and frequent loading‑unloading cycles. Keep consistent dimensional performance amid continuous mass‑volume usage. Satisfy strict protection requirements for semiconductor assembly and test workflows.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4 mm | ||
| Matrix QTY | 50.7×50.7×4 mm | ||
| Service | Accept OEM, ODM | ||
Serve semiconductor assembly, chip sorting and performance testing. Protect precision IC parts through thermal treatment, inspection and transit phases. Cut loss brought by static electricity and mechanical abrasion.
Fit component warehouses and electronics OEM production sites. Provide safe containment for varied precision semiconductor parts during large‑batch handling tasks.
Use heavy‑duty corrugated cartons paired with shock‑absorbent inner fillers for finished goods. Apply firm strapping to avoid squeezing or shifting inside packages. Take extra care for semiconductor‑grade goods to eliminate risk of deformation or surface scratch before shipment.
Arrange air, sea or express delivery strictly based on shipping instructions from buyers. Generate full‑set shipping papers once goods depart warehouse. Track cargo movement actively and feed latest logistics status to overseas clients throughout whole delivery cycle.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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