Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 1.4X1.0X0.65 mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.25mm |
| Mold Type | Injection |
| Capacity | 21X18=378 PCS |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.7×50.7×4 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25021 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
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Product Specification
| Payment Terms | T/T | Color | Black |
| Cavity Size | 1.4X1.0X0.65 mm | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packing Level | Transport package |
| Warpage | Warpage MAX 0.25mm | Mold Type | Injection |
| Capacity | 21X18=378 PCS | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.7×50.7×4 mm | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes | Packaging Details | CARTON, PALLET |
| Model Number | HN25021 | Certification | ROHS, ISO |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | Uniform-Grid waffle trays for IC turnover ，Durable waffle trays for fine-pitch IC ，Waffle pack chip trays with transit protection | ||
Hold delicate fine‑pitch ICs inside neat grid cavities. Stop tiny semiconductor chips from shifting amid frequent handling. Deliver steady performance through repeated turnover cycles to fit continuous manufacturing rhythms.
Absorb minor impact and lower scratch and collision risks. Cut component rejects brought by unstable chip placement. Adapt well to high‑speed manufacturing flows without complicated adjustments. Keep chip positions secure through testing, checking and cross‑workshop transfer.
Enable safe stacking to save valuable production workspace. Maintain rigid structure under continuous transit and turnover conditions. Satisfy strict protection requirements for advanced semiconductor component processing.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4 mm | ||
| Matrix QTY | 21X18=378 PCS | ||
| Service | Accept OEM, ODM | ||
Serve fine‑pitch IC sorting, performance testing and intra‑factory turnover tasks. Protect miniature semiconductor chips through inspection and station‑to‑station transfer. Cut losses resulting from component displacement and surface abrasion.
Fit semiconductor manufacturing sites and component transit processes. Deliver dependable holding solutions for various precision chips during large‑batch turnover operations.
Seal every batch with anti‑static bags before loading reinforced export cartons. Add shock‑resistant fillers to buffer vibration and compression harm. Carry out full appearance inspection prior to dispatching semiconductor‑grade goods.
Arrange shipment modes strictly following confirmed customer requirements. Generate complete set of shipping paperwork once goods leave warehouse. Keep overseas buyers updated on latest cargo delivery progress.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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