Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 12.12X2.04X0.86 mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.22mm |
| Mold Type | Injection |
| Capacity | 3X13=39 PCS |
| Outline Line Size | 50.8x50.8x3.94 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25026 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
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Product Specification
| Payment Terms | T/T | Color | Black |
| Cavity Size | 12.12X2.04X0.86 mm | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packing Level | Transport package |
| Warpage | Warpage MAX 0.22mm | Mold Type | Injection |
| Capacity | 3X13=39 PCS | Outline Line Size | 50.8x50.8x3.94 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes | Packaging Details | CARTON, PALLET |
| Model Number | HN25026 | Certification | ROHS, ISO |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | Waffle Pack Chip Trays for semiconductor IC testing ，Waffle Pack Chip Trays for storage protection ，Semiconductor IC handling waffle pack trays | ||
Separate individual IC chips inside special slot structures. Prevent mutual friction and collision during frequent operational movements. Maintain stable performance under long‑term cyclic usage within semiconductor production lines.
Isolate chips from external contact to cut surface‑damage risks. Fit continuous test workflows without extra adjustment work. Hold components steady across testing, sorting and warehouse storage cycles.
Support neat stacking to make full use of available factory space. Keep original slot shape under regular stacking pressure. Meet high‑standard storage and handling demands for precision semiconductor components.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8x50.8x3.94 mm | ||
| Matrix QTY | 3X13=39 PCS | ||
| Service | Accept OEM, ODM | ||
Handle semiconductor IC testing, component sorting and short‑term stock keeping work. Isolate precision chips while carrying out inspection and in‑plant circulation. Lower scrap rate caused by chip‑to‑chip rubbing and impact.
Work within semiconductor test workshops and component inventory areas. Offer reliable holding solution for diverse IC parts in mass‑batch production cycles.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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