Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Mold Type | Injection |
| Packing Level | Transport package |
| Supply Ability | 2000PCS/Day |
| Reusable | Yes |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Color | Black |
| Delivery Time | 10 workdays |
| Cavity Size | 6.04x3.63x0.67 mm |
| Tray Shape | Rectangular |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Warpage | Warpage MAX 0.2mm |
| Capacity | 5x7=35 PCS |
| Packaging Details | CARTON, PALLET |
| Clean Class | General And Ultrasonic Cleaning |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.8×50.8×3.94 mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Model Number | HN25010 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Payment Terms | T/T | Mold Type | Injection |
| Packing Level | Transport package | Supply Ability | 2000PCS/Day |
| Reusable | Yes | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Color | Black | Delivery Time | 10 workdays |
| Cavity Size | 6.04x3.63x0.67 mm | Tray Shape | Rectangular |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Warpage | Warpage MAX 0.2mm |
| Capacity | 5x7=35 PCS | Packaging Details | CARTON, PALLET |
| Clean Class | General And Ultrasonic Cleaning | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.8×50.8×3.94 mm | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Model Number | HN25010 | Certification | ROHS, ISO |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | high-temp waffle pack chip trays ，semiconductor IC chip trays ，durable waffle pack trays | ||
Block static charges that ruin sensitive semiconductor dies. Tolerate repeated high‑temperature exposure without warping. Hunting for robust carriers for precision chip parts? Stand firm against harsh conditions inside busy production lines.
Lock fine‑pitch IC units inside neat grid cavities. Stop unwanted shifting while chips undergo testing and sorting. Eliminate scratches and impact risks to costly semiconductor components. Bring reliable protection across full processing cycles.
Survive countless cycles of loading and unloading. Keep solid dimensional performance under continuous mass‑production use. Satisfy strict protection requirements from semiconductor assembly operations.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×3.94 mm | ||
| Matrix QTY | 5x7=35 PCS | ||
| Service | Accept OEM, ODM | ||
Support semiconductor assembly, chip testing and component transit. Protect fine‑pitch ICs through reflow, sorting and inspection. Reduce scrap loss triggered by static electricity and mechanical impact.
Fit electronics OEM workshops and component warehouses. Provide safe containment for varied integrated‑circuit units during regular large‑batch handling tasks.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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