Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 5.5X3.2X0.38 mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.23mm |
| Mold Type | Injection |
| Capacity | 6x10=60 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.7×50.7×4mm |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25019 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
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Product Specification
| Payment Terms | T/T | Color | Black |
| Cavity Size | 5.5X3.2X0.38 mm | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packing Level | Transport package |
| Warpage | Warpage MAX 0.23mm | Mold Type | Injection |
| Capacity | 6x10=60 PCS | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Outline Line Size | 50.7×50.7×4mm |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes | Packaging Details | CARTON, PALLET |
| Model Number | HN25019 | Certification | ROHS, ISO |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | waffle pack chip trays with uniform grids ，fine-pitch IC protection waffle trays ，waffle pack trays for IC protection | ||
Lock fragile fine‑pitch IC parts inside precision grid cavities. Prevent tiny semiconductor units from sliding amid frequent handling work. Hunting for dependable carriers for miniature chips? Sustain stable performance over countless working cycles.
Defend chips against collision and surface scratch throughout manufacturing flows. Cut scrap risks caused by random component movement. Adapt well to high‑speed production workflows without extra modification. Keep chip placement steady in testing, checking and transfer procedures.
Allow stacked placement to conserve valuable factory workspace. Maintain accurate dimensions under long‑term heavy‑duty usage. Satisfy strict holding standards for sophisticated semiconductor assembly processes.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4mm | ||
| Matrix QTY | 6x10=60 PCS | ||
| Service | Accept OEM, ODM | ||
Handle fine‑pitch IC sorting, performance testing and component assembly work. Shield miniature semiconductor chips during inspection and intra‑factory transfer. Minimize losses resulting from part displacement and surface damage.
Work within electronics production plants and component inventory areas. Provide dependable holding solution for multiple precision chips during large‑batch processing assignments.
Seal every lot with anti‑static inner bags before loading heavy‑duty export cartons. Fill cushion materials to guard goods against squeeze damage. Carry out full‑item checking before dispatching semiconductor‑grade products.
Arrange sea freight, air freight or courier service per buyers’ confirmed shipping plans. Issue full shipping paperwork once goods leave warehouse. Share latest logistics status timely with overseas purchasers.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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