Shenzhen Hiner Technology Co., Ltd.
| Mold Type | Injection |
| Capacity | 4X8=32 PCS |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.7×50.7×6 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 8.95x4.41x1.7 mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.24mm |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25028 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Mold Type | Injection | Capacity | 4X8=32 PCS |
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Outline Line Size | 50.7×50.7×6 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Payment Terms | T/T |
| Color | Black | Cavity Size | 8.95x4.41x1.7 mm |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package | Warpage | Warpage MAX 0.24mm |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Reusable | Yes | Packaging Details | CARTON, PALLET |
| Model Number | HN25028 | Certification | ROHS, ISO |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | Anti-static waffle pack chip trays ，ESD protection chip trays ，Waffle pack trays against contamination | ||
Secure single chips within separate square cavities. Keep chips apart to eliminate scraping damage when stacked or shifted. Keep rigid structural shape over repeated handling cycles.
Offer stable holding during workshop sorting inspection and stock management. Prevent chips from sliding out when moved between work stations. Fit continuous day‑to‑day semiconductor production workflows.
Allow stable multi‑layer stacking to conserve valuable workshop storage space. Keep each component fixed inside respective cavity positions. Meet strict holding requirements for fragile semiconductor IC parts.
| Brand | Hiner-pack | ||
| Color | Black | ||
| 50.7×50.7×6 mm | 50.7×50.7×6 mm | ||
| Matrix QTY | 4X8=32 PCS | ||
| Service | Accept OEM, ODM | ||
Hold semiconductor IC units during internal workshop sorting and visual inspection. Keep fragile chips safe while transferring between different production stations. Reduce defective items caused by friction and position shifting.
Suit electronics production lines and component warehouse areas. Serve as practical holding solution for large‑batch semiconductor component daily processing.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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