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{"title":"Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module","imgUrl":"https:\/\/img.chinax.com\/nimg\/98\/13\/82c18523750281362c4b3876b4d7-200x200-1\/customized_black_esd_jedec_ic_trays_ultrasonic_cleaning_for_pcba_module.jpg","attrs":{"Material":"PPE","Temperature":"125\u00b0C","Property":"ESD","Surface resistance":"1.0x10E4~1.0x10E11\u03a9"}}
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Heat Resistant MPPO JEDEC IC Trays Safeguard Integrated Circuits From Contamination And Impact
JEDEC IC Tray is crafted from heat-resistant MPPO material, designed to protect delicate integrated circuits from contamination and physical impact. Rigid structure keeps ICs stable and secure during automated handling and transport.
JEDEC IC Tray adapts to diverse production needs with customizable cavity layouts and dimensions. Whether standard JEDEC specifications or tailored component sizes, it integrates seamlessly into manufacturing and logistics workflows.
JEDEC IC Tray ensures reliable protection across IC fabrication, testing, and distribution. Heat-resistant properties withstand high-temperature processes, while anti-contamination design preserves component integrity throughout the supply chain.
Key Features/ Benefits
Heat-resistant MPPO material (up to 150°C)
ISO certified production
Anti-contamination surface design
Clean production support
Flexible customization
Specifications
Brand
Hiner-pack
Model
HN25035
Material
MPPO
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×7.62 mm
Cavity Size
9.81×10.87×1.5 mm
Matrix QTY
14X8=112 PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
JEDEC IC Tray is widely used in semiconductor IC fabrication, testing, and assembly lines. Heat-resistant MPPO material withstands high-temperature processes, protecting chips from thermal damage and contamination.
JEDEC IC Tray also serves logistics and packaging teams, providing secure, stackable storage for finished ICs. Customized design ensures compatibility with automated handling systems, reducing manual errors and improving supply chain efficiency.
Customized Services
JEDEC IC Tray offers full customization for every design detail. Adjust cavity size, pitch, and layout to match unique IC dimensions. Add custom markings, notches, or anti-static features for better production line compatibility.
Engineering team collaborates closely to develop tailored tray solutions, from prototype to mass production. Whether small-batch prototypes or large-scale runs, JEDEC IC Tray delivers precise, reliable protection for valuable semiconductor components.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
