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Durable JEDEC IC Trays Keep Components Clean And Protected During Packaging
Durable JEDEC IC Tray shields semiconductor components from dust and physical harm during packaging. Sturdy build withstands impacts and scratches, preserving component integrity from start to finish.
Durable JEDEC IC Tray follows JEDEC standards, ensuring smooth integration with automated packaging lines. It reduces component failure rates, supporting consistent quality control across production stages.
Durable JEDEC IC Tray adapts to diverse component sizes with customizable cavities. Whether for high-volume runs or precision packaging, it delivers reliable, clean protection for sensitive electronic parts.
Key Features/ Benefits
RoHS compliant materials
Dust reduction and anti-contamination
Customizable cavity layouts
Secure component retention
JEDEC standard compliance
Specifications
Brand
Hiner-pack
Model
HN25048
Material
MPPO
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×7.62 mm
Cavity Size
7.1×7.1×1.4 mm
Matrix QTY
10x23=230 PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Durable JEDEC IC Tray is ideal for semiconductor packaging lines, clean room manufacturing, and component storage. It prevents dust buildup and physical damage, maintaining component purity during high-precision production.
Durable JEDEC IC Tray also supports in-process handling and logistics, offering stable protection between production steps. Custom cavities hold components firmly, minimizing shifting and impact during automated packaging operations.
Packaging & Shipping/ Services
Durable JEDEC IC Trays are packaged in anti-static, durable materials with secure stacking and cushioning inserts. Custom packaging solutions are available to meet specific handling and storage requirements.
All shipments are tracked and handled by trusted carriers for reliable worldwide delivery. Professional logistics support ensures timely, safe arrival, with efficient customs clearance and documentation for international orders.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...