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{"title":"Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module","imgUrl":"https:\/\/img.chinax.com\/nimg\/98\/13\/82c18523750281362c4b3876b4d7-200x200-1\/customized_black_esd_jedec_ic_trays_ultrasonic_cleaning_for_pcba_module.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN18102","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
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Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly
Durable JEDEC IC Tray keeps semiconductor components clean by reducing dust buildup during packaging and assembly. Sturdy build withstands frequent handling, shielding parts from scratches and impacts.
Durable JEDEC IC Tray follows JEDEC standards, ensuring smooth integration with automated production lines. It lowers component damage rates, supporting consistent quality across manufacturing stages.
Durable JEDEC IC Tray fits diverse component sizes with customizable cavities. Whether for high-volume runs or precision assembly, it delivers reliable, dust-free protection for sensitive electronic parts.
Key Features/ Benefits
Deliver durable construction.
Dust reduction and anti-contamination
Customizable cavity layouts
Secure component retention
JEDEC standard compliance
Specifications
Brand
Hiner-pack
Model
HN25047
Material
MPPO
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×7.62 mm
Cavity Size
7.5×6.5×2.05 mm
Matrix QTY
10x23=230 PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Durable JEDEC IC Tray works perfectly for semiconductor packaging lines, IC assembly facilities, and clean room manufacturing. It prevents dust contamination, preserving component purity during high-precision production.
Durable JEDEC IC Tray also supports in-process handling and storage, offering stable protection between production steps. Custom cavities hold components firmly, minimizing shifting and damage during automated assembly operations.
Packaging & Shipping/ Services
Durable JEDEC IC Tray offers full customization to match unique production requirements. Adjust cavity size, pitch, and layout to fit specific component dimensions and automated line workflows.
Engineering team collaborates closely to develop tailored tray solutions, from prototype to mass production. Add custom markings, mounting holes, or anti-slip features to optimize dust control and handling efficiency in packaging and assembly.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
