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{"title":"JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD","imgUrl":"https:\/\/img.chinax.com\/nimg\/23\/7e\/8ea2535e8c50bb59af8c84387bab-200x200-1\/jedec_standard_lga_ic_semiconductor_tray_hips_materials_non_esd.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1979","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"JEDEC IC Trays ESD Durable PPE SGS Approved","imgUrl":"https:\/\/img.chinax.com\/nimg\/ca\/9f\/94818d8d9be522349e39adbaa935-200x200-1\/jedec_ic_trays_esd_durable_ppe_sgs_approved.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"JEDEC standard tray 322.6*135.9*7.62&12.19mm","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant","imgUrl":"https:\/\/img.chinax.com\/nimg\/1b\/a8\/6b7a0e555ec5bc553cc268e43c8c-200x200-1\/odm_pcb_module_esd_black_ic_packaging_trays_heat_resistant.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1903","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module","imgUrl":"https:\/\/img.chinax.com\/nimg\/98\/13\/82c18523750281362c4b3876b4d7-200x200-1\/customized_black_esd_jedec_ic_trays_ultrasonic_cleaning_for_pcba_module.jpg","attrs":{"Material":"PPE","Temperature":"125\u00b0C","Property":"ESD","Surface resistance":"1.0x10E4~1.0x10E11\u03a9"}}
{"title":"Antistatic PPE Standard JEDEC ESD Protect Module Tray","imgUrl":"https:\/\/img.chinax.com\/nimg\/58\/4a\/6d869695bc67abee749b7bc79c7e-200x200-1\/antistatic_ppe_standard_jedec_esd_protect_module_tray.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1984","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"High Temperature Resistance PPO JEDEC IC Trays Durable ESD","imgUrl":"https:\/\/img.chinax.com\/nimg\/09\/46\/faf87a26d6178b473e601f3fc297-200x200-1\/high_temperature_resistance_ppo_jedec_ic_trays_durable_esd.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1858","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging
Shield delicate semiconductor components from dust and damage during packaging operations. Minimize contamination risks effectively. Built with durable structure to meet JEDEC standards for reliable industrial use. Seeking trusted tray solutions for secure semiconductor packaging?
Fit automated packaging lines and cleanroom environments perfectly. Perform steadily in component handling and packaging procedures. Adapt to diverse semiconductor packaging processes smoothly.
Enable safe component storage and logistics. Support custom designs to meet specific packaging demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits
Deliver durable construction.
Reduce dust contamination.
Dust minimization.
Component protection.
Flexible customization.
Specifications
Brand
Hiner-pack
Model
HN25006
Material
MPPO
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6x135.9x7.62 mm
Cavity Size
16×9.5×4.72 mm
Matrix QTY
4x9=36 PCS
Warpage
MAX 0.76mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.
Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.
Packaging & Shipping/ Services
Offer targeted customization for JEDEC IC trays tailored to packaging and transportation needs. Collaborate closely with teams to design cavity shapes, anti-slip structures, and shock-absorbent materials for secure component handling during packaging and long-distance logistics. Develop anti-static or dust-sealed variants, and validate prototypes through vibration and drop tests. Deliver personalized tray solutions that safeguard semiconductor components throughout packaging, loading, and inter-factory or global shipment processes.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
