Shenzhen Hiner Technology Co., Ltd.
| Mold Type | Injection |
| Capacity | 10x10=100 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 3x0.75 mm |
| Outline Line Size | 50.7×50.7×4 mm |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.21mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Tray Shape | Rectangular |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Clean Class | General And Ultrasonic Cleaning |
| Model Number | HN24206 |
| Certification | ROHS, ISO |
| Brand Name | Hiner-pack |
| Place of Origin | China |
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Product Specification
| Mold Type | Injection | Capacity | 10x10=100 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Payment Terms | T/T |
| Color | Black | Cavity Size | 3x0.75 mm |
| Outline Line Size | 50.7×50.7×4 mm | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package | Warpage | Warpage MAX 0.21mm |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Tray Shape | Rectangular | Reusable | Yes |
| Packaging Details | CARTON, PALLET | Clean Class | General And Ultrasonic Cleaning |
| Model Number | HN24206 | Certification | ROHS, ISO |
| Brand Name | Hiner-pack | Place of Origin | China |
| High Light | ESD IC chip trays ，Precision semiconductor storage trays ，Delicate IC chip storage trays | ||
Feature precision-engineered cavities to cradle delicate semiconductors firmly, preventing shifting and electrostatic damage during handling. Maintain stable performance in high-frequency production scenarios, reducing component loss and ensuring consistent operational reliability.
Deliver reliable ESD protection to safeguard sensitive components, maintaining performance in industrial production and storage environments. Resist wear and deformation for long-term use, supporting continuous workflow without interruptions.
Support full customization of cavity size and layout to match diverse IC specifications, aligning with clean production standards for optimal efficiency. Adapt to various automated production lines and packaging requirements, delivering tailored solutions for semiconductor manufacturers.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4 mm | ||
| Matrix QTY | 10x10=100 PCS | ||
| Service | Accept OEM, ODM | ||
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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