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Heavy Duty Industrial Grid Waffle Trays for Fine Pitch IC Handling
Feature heavy duty industrial-grade grid structure to securely hold fine pitch ICs, preventing shifting and collision during handling and transportation. Built with durable materials to withstand frequent use in busy production lines, effectively reducing component damage and loss.
Deliver stable protection for sensitive electronic parts, shielding against impact and static risks. Maintain consistent performance in long-term industrial operations, supporting smooth workflow and minimizing downtime.
Support full customization of grid size, spacing and cavity depth to match diverse IC specifications. Adapt to various automated production lines and cleanroom standards, providing tailored solutions for semiconductor manufacturing needs.
Key Features/ Benefits
Reliable component protection
Durable industrial-grade material
Long-lasting durability
Customizable cavity layout
Precise waffle structure.
Specifications
Brand
Hiner-pack
Model
HN24233
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.7×50.7×4mm
Cavity Size
1.2X0.5X0.5 mm
Matrix QTY
17x25=425 PCS
Warpage
MAX 0.26mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work seamlessly with automated pick-and-place systems and industrial cleanroom environments. Ideal for both temporary placement and long-term safekeeping of delicate semiconductor chips.
Widely applied in semiconductor factories, IC packaging plants, electronic assembly workshops and component warehouses. Perfect for industrial production, inter-department transportation and high-precision component storage.
Packaging & Shipping/ Services
Packed in custom anti-static corrugated cartons with foam inserts to cushion against shocks and prevent surface scratches during long-distance transit. Each tray is wrapped in anti-static film to maintain ESD protection integrity.
Support stackable palletization for bulk shipments, optimizing logistics efficiency. Offer flexible shipping options including sea, air and express delivery, with tracking available for every order to ensure on-time, intact arrival.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
