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{"title":"Digital Array Waffle Pack Chip Trays Durable Anti Static For Component","imgUrl":"https:\/\/img.chinax.com\/nimg\/9b\/23\/2135a8772f3ffac231786b2c9b64-200x200-1\/digital_array_waffle_pack_chip_trays_durable_anti_static_for_component.jpg","attrs":{"Material":"ABS","Color":"Black","Property":"ESD","Design":"Standard"}}
Adopts high temperature resistant material and anti-static structure to provide stable performance in harsh production conditions. Effectively fixes semiconductor IC chips and avoids displacement or damage during high temp processing.
Works well in high temperature processing procedures and automatic production lines. Ensures stable placement of chips and maintains component integrity in continuous operation.
Supports customization of cavity size and arrangement to fit different IC specifications. Focuses on safe fixing and reliable protection to meet various semiconductor production requirements.
Key Features/ Benefits
ESD protection
High temperature resistance
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand
Hiner-pack
Model
HN24199
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.8×50.8×3.94 mm
Cavity Size
4.1x4x0.9 mm
Matrix QTY
7x7=49 PCS
Warpage
MAX 0.2mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Suitable for high temperature semiconductor processing, chip baking, component testing and packaging procedures. Fits well in automatic production lines and high temperature working environments.
Applied in chip production, semiconductor packaging, electronic component processing and factory internal transportation. Widely used in semiconductor factories and electronic manufacturing plants.
Packaging & Shipping/ Services
Packed in standard cartons with inner protective layers to avoid scratches and deformation. Stacked safely for bulk transportation.
Supports sea, air and international express shipping. Ensures products arrive in good condition and ready for direct use in production.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
