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{"title":"ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved","imgUrl":"https:\/\/img.chinax.com\/nimg\/cf\/6b\/c48104004339a2f5b7b454d7f596-200x200-1\/esd_antistatic_matrix_chip_waffle_tray_moisture_protection_sgs_approved.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"To meet all kinds of custom needs of customers","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Electronic Parts Waffle Pack Tray Stable Resistance ESD ABS Custom Size","imgUrl":"https:\/\/img.chinax.com\/nimg\/c6\/0e\/36d8176d53b75d548d69b2c74501-200x200-1\/electronic_parts_waffle_pack_tray_stable_resistance_esd_abs_custom_size.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN21012-2","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"2-inch and 4-inch Waffle Pack Chip Trays","imgUrl":"https:\/\/img.chinax.com\/nimg\/4e\/ed\/1b3e9a865eb3a388b81cb5839d49-200x200-1\/2_inch_and_4_inch_waffle_pack_chip_trays.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"4Inch","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static","imgUrl":"https:\/\/img.chinax.com\/nimg\/70\/c5\/43bab51918bbcc25ff82ed4fe0c0-200x200-1\/tiny_modules_4_inch_waffle_pack_chip_trays_esd_stable_anti_static.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN21016","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"ABS Black Waffle Pack Chip Trays","imgUrl":"https:\/\/img.chinax.com\/nimg\/f3\/89\/90f43b5c38a516b60ad759a1fb49-200x200-1\/abs_black_waffle_pack_chip_trays.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"Outline Size 2inch 3Inch 4Inch","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
Adopts high temperature resistant material and anti-static structure to provide stable performance in harsh production conditions. Effectively fixes semiconductor IC chips and avoids displacement or damage during high temp processing.
Works well in high temperature processing procedures and automatic production lines. Ensures stable placement of chips and maintains component integrity in continuous operation.
Supports customization of cavity size and arrangement to fit different IC specifications. Focuses on safe fixing and reliable protection to meet various semiconductor production requirements.
Key Features/ Benefits
ESD protection
High temperature resistance
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand
Hiner-pack
Model
HN24199
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.8×50.8×3.94 mm
Cavity Size
4.1x4x0.9 mm
Matrix QTY
7x7=49 PCS
Warpage
MAX 0.2mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Suitable for high temperature semiconductor processing, chip baking, component testing and packaging procedures. Fits well in automatic production lines and high temperature working environments.
Applied in chip production, semiconductor packaging, electronic component processing and factory internal transportation. Widely used in semiconductor factories and electronic manufacturing plants.
Packaging & Shipping/ Services
Packed in standard cartons with inner protective layers to avoid scratches and deformation. Stacked safely for bulk transportation.
Supports sea, air and international express shipping. Ensures products arrive in good condition and ready for direct use in production.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
