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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &
China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &

  1. China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &
  2. China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &
  3. China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &
  4. China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &
  5. China Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &

Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static &

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Incoterms EXW, FOB, CIF, DDU, DDP
Capacity 4x6=24 PCS
Tray Shape Rectangular
Cavity Size 8.76x5.51x0.685 mm
Payment Terms T/T
Delivery Time 10 workdays
Quality Assurance Delivery Guarantee, Reliable Quality
Packing Level Transport package
Reusable Yes
Warpage Warpage MAX 0.26mm
Supply Ability 2000PCS/Day
Ic Type BGA,QFP,QFN,LGA,PGA
Color Black
Packaging Details CARTON, PALLET
Mold Type Injection
Clean Class General And Ultrasonic Cleaning
Outline Line Size 50.8×50.8×3.94 mm
Model Number HN24191
Brand Name Hiner-pack
Place of Origin China
Certification ROHS, ISO

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  1. Product Details
  2. Company Details

Product Specification

Tray Weight Varies, Typically Up To 500 Grams Per Cavity Incoterms EXW, FOB, CIF, DDU, DDP
Capacity 4x6=24 PCS Tray Shape Rectangular
Cavity Size 8.76x5.51x0.685 mm Payment Terms T/T
Delivery Time 10 workdays Quality Assurance Delivery Guarantee, Reliable Quality
Packing Level Transport package Reusable Yes
Warpage Warpage MAX 0.26mm Supply Ability 2000PCS/Day
Ic Type BGA,QFP,QFN,LGA,PGA Color Black
Packaging Details CARTON, PALLET Mold Type Injection
Clean Class General And Ultrasonic Cleaning Outline Line Size 50.8×50.8×3.94 mm
Model Number HN24191 Brand Name Hiner-pack
Place of Origin China Certification ROHS, ISO
High Light Fine Pitch IC Components ESD Waffle TraysAnti-Static & Dust-Proof Waffle Pack Chip TraysCustomizable Cavity Size IC Component Trays
Professional ESD Waffle Trays for Fine Pitch IC Components
Features precision waffle structure to hold fine pitch ICs stably. Effectively blocks particulate contamination and avoids ESD damage during whole process. Made of durable anti-static material to maintain stable performance in various working conditions.

Matches well with automatic production and processing lines. Works smoothly in chip loading, transferring and sorting. Improves operation efficiency and ensures component integrity in daily production.

Accepts full customization on cavity size and arrangement to fit different components. Focuses on safe protection and efficient packaging. Provides professional solutions for high-precision semiconductor applications.
Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24191
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 8.76x5.51x0.685 mm
Matrix QTY 4x6=24 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for high-precision chip processing, component sorting, chip testing and small device assembly. Works well in automatic production lines and static controlled workshops.

Ideal for factory internal transportation, finished product storage and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants and electronic component suppliers.
Packaging & Shipping/ Services
Supports customized packaging plans to ensure safe delivery. Protects trays from deformation and damage during long distance transportation.

Provides stable and reliable packaging solutions for bulk orders. Helps maintain product quality and arrives in good condition for customers.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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