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Professional ESD Waffle Trays for Fine Pitch IC Components
Features precision waffle structure to hold fine pitch ICs stably. Effectively blocks particulate contamination and avoids ESD damage during whole process. Made of durable anti-static material to maintain stable performance in various working conditions.
Matches well with automatic production and processing lines. Works smoothly in chip loading, transferring and sorting. Improves operation efficiency and ensures component integrity in daily production.
Accepts full customization on cavity size and arrangement to fit different components. Focuses on safe protection and efficient packaging. Provides professional solutions for high-precision semiconductor applications.
Key Features/ Benefits
Anti-static & dust-proof design for safe chip handling
Offers stable cleanroom-grade contamination control
Stable component holding
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
Precise waffle structure.
Specifications
Brand
Hiner-pack
Model
HN24191
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
50.8×50.8×3.94 mm
Cavity Size
8.76x5.51x0.685 mm
Matrix QTY
4x6=24 PCS
Warpage
MAX 0.26mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Suitable for high-precision chip processing, component sorting, chip testing and small device assembly. Works well in automatic production lines and static controlled workshops.
Ideal for factory internal transportation, finished product storage and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants and electronic component suppliers.
Packaging & Shipping/ Services
Supports customized packaging plans to ensure safe delivery. Protects trays from deformation and damage during long distance transportation.
Provides stable and reliable packaging solutions for bulk orders. Helps maintain product quality and arrives in good condition for customers.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
