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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

  1. China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
  2. China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
  3. China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
  4. China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
  5. China Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Mold Type Injection
Capacity 5x7=35 PCS
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Ic Type BGA,QFP,QFN,LGA,PGA
Payment Terms T/T
Color Black
Cavity Size 6.7X4.0X1.07 mm
Quality Assurance Delivery Guarantee, Reliable Quality
Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size 50.8×50.8×3.94 mm
Reusable Yes
Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning
Packaging Details CARTON, PALLET
Packing Level Transport package
Warpage Warpage MAX 0.26mm
Model Number HN24200
Certification ROHS, ISO
Brand Name Hiner-pack
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Mold Type Injection Capacity 5x7=35 PCS
Delivery Time 10 workdays Incoterms EXW, FOB, CIF, DDU, DDP
Ic Type BGA,QFP,QFN,LGA,PGA Payment Terms T/T
Color Black Cavity Size 6.7X4.0X1.07 mm
Quality Assurance Delivery Guarantee, Reliable Quality Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Outline Line Size 50.8×50.8×3.94 mm
Reusable Yes Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning Packaging Details CARTON, PALLET
Packing Level Transport package Warpage Warpage MAX 0.26mm
Model Number HN24200 Certification ROHS, ISO
Brand Name Hiner-pack Place of Origin China
Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
Feature uniform grid design to hold fine pitch ICs steadily without shifting. Fit various industrial processes and protect sensitive components from damage during daily operation.

Bring reliable performance for long-term use and reduce component loss in production and transfer. Match automatic equipment to improve working efficiency effectively.

Accept customized cavity size and layout to meet different chip requirements. Focus on practical protection to satisfy diverse production demands.
Key Features/ Benefits 
  • Secure component fixing
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24200
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.7X4.0X1.07 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work stably in automatic industrial systems and daily manufacturing processes.

Applied in semiconductor factories, electronic assembly plants and chip packaging workshops. Ideal for industrial production, internal transportation and long-term component storage.
Packaging & Shipping/ Services
Packed in standard cartons with protective inner layers to avoid scratches and deformation. Support safe stacking for bulk transportation.

Available for sea, air and international express shipping. Ensure products arrive in good condition and ready for immediate industrial use.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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