Shenzhen Hiner Technology Co., Ltd.
| Cavity Size | 1.68x1.55x0.67 mm |
| Mold Type | Injection |
| Color | Black |
| Packaging Details | CARTON, PALLET |
| Clean Class | General And Ultrasonic Cleaning |
| Packing Level | Transport package |
| Outline Line Size | 50.7×50.7×7.4 mm |
| Warpage | Warpage MAX 0.21mm |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Reusable | Yes |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Tray Shape | Rectangular |
| Delivery Time | 10 workdays |
| Payment Terms | T/T |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Capacity | 16x17=272 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Model Number | HN24177 |
| Certification | ROHS, ISO |
| Place of Origin | China |
| Brand Name | Hiner-pack |
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Product Specification
| Cavity Size | 1.68x1.55x0.67 mm | Mold Type | Injection |
| Color | Black | Packaging Details | CARTON, PALLET |
| Clean Class | General And Ultrasonic Cleaning | Packing Level | Transport package |
| Outline Line Size | 50.7×50.7×7.4 mm | Warpage | Warpage MAX 0.21mm |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Reusable | Yes | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Tray Shape | Rectangular | Delivery Time | 10 workdays |
| Payment Terms | T/T | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Capacity | 16x17=272 PCS | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Model Number | HN24177 | Certification | ROHS, ISO |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | High-Temp Waffle Pack Tray ，Durable IC Chip Tray ，Precision Grid Design ESD Tray | ||
Deliver precise grid structure to hold delicate IC components firmly, preventing shifting and damage during handling. Built with durable material for consistent performance in industrial environments. Offer reliable compatibility with semiconductor production workflows. Seeking high-density trays for secure component storage?
Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in component loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.
Support fully customized grid spacing and cavity dimensions to match specific component sizes. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 16x17=272 PCS | ||
| Service | Accept OEM, ODM | ||
Also utilized in inter-factory component transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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