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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

  1. China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
  2. China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
  3. China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
  4. China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
  5. China ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Ic Type BGA,QFP,QFN,LGA,PGA
Mold Type Injection
Capacity 17x24=408 PCS
Payment Terms T/T
Color Black
Cavity Size 1.58x0.85x0.7 mm
Quality Assurance Delivery Guarantee, Reliable Quality
Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size 50.7×50.7×4 mm
Tray Shape Rectangular
Reusable Yes
Clean Class General And Ultrasonic Cleaning
Packaging Details CARTON, PALLET
Packing Level Transport package
Warpage Warpage MAX 0.22mm
Model Number HN24194
Certification ROHS, ISO
Brand Name Hiner-pack
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time 10 workdays Incoterms EXW, FOB, CIF, DDU, DDP
Ic Type BGA,QFP,QFN,LGA,PGA Mold Type Injection
Capacity 17x24=408 PCS Payment Terms T/T
Color Black Cavity Size 1.58x0.85x0.7 mm
Quality Assurance Delivery Guarantee, Reliable Quality Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Outline Line Size 50.7×50.7×4 mm
Tray Shape Rectangular Reusable Yes
Clean Class General And Ultrasonic Cleaning Packaging Details CARTON, PALLET
Packing Level Transport package Warpage Warpage MAX 0.22mm
Model Number HN24194 Certification ROHS, ISO
Brand Name Hiner-pack Place of Origin China
ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
Deliver precise waffle structure to cradle delicate IC chips tightly, preventing movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.

Integrate seamlessly with automated production lines and clean manufacturing workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.

Support full customization of cavity size and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.
Key Features/ Benefits 
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Secure chip holding
  • ESD-safe protection
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24194
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 1.58x0.85x0.7 mm
Matrix QTY 17x24=408 PCS
Warpage MAX 0.22mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for high-precision chip processing, component sorting, device testing, and small device assembly. Work well in automatic production lines and static-controlled workshops.

Ideal for factory internal transportation, finished product storage, and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants, and electronic component suppliers.
Customized Services
Provide fully customized solutions for waffle pack chip trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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