Shenzhen Hiner Technology Co., Ltd.
| Clean Class | General And Ultrasonic Cleaning |
| Warpage | Warpage MAX 0.23mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Cavity Size | 2.2x1.35x0.53 mm |
| Payment Terms | T/T |
| Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Delivery Time | 10 workdays |
| Mold Type | Injection |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Outline Line Size | 50.8×50.8×4 mm |
| Packaging Details | CARTON, PALLET |
| Reusable | Yes |
| Color | Black |
| Capacity | 10x9=90 PCS |
| Packing Level | Transport package |
| Supply Ability | 2000PCS/Day |
| Brand Name | Hiner-pack |
| Model Number | HN24190 |
| Certification | ROHS, ISO |
| Place of Origin | China |
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Product Specification
| Clean Class | General And Ultrasonic Cleaning | Warpage | Warpage MAX 0.23mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Cavity Size | 2.2x1.35x0.53 mm |
| Payment Terms | T/T | Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Delivery Time | 10 workdays |
| Mold Type | Injection | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Outline Line Size | 50.8×50.8×4 mm |
| Packaging Details | CARTON, PALLET | Reusable | Yes |
| Color | Black | Capacity | 10x9=90 PCS |
| Packing Level | Transport package | Supply Ability | 2000PCS/Day |
| Brand Name | Hiner-pack | Model Number | HN24190 |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | Anti-Static Waffle Pack Chip Trays ，Reusable Semiconductor IC Trays ，Customizable Cavity Size IC Chip Trays | ||
Deliver precise waffle structure to cradle delicate IC chips tightly, eliminating movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.
Integrate seamlessly with automated packaging lines and cleanroom workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.
Support full customization of cavity size, spacing, and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×4 mm | ||
| Matrix QTY | 10x9=90 PCS | ||
| Service | Accept OEM, ODM | ||
Also applied in inter-plant component transfer, international shipping of sensitive chips, and long-term inventory storage. Serve semiconductor fabs, IC packaging facilities, and global electronic component distributors.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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