Shenzhen Hiner Technology Co., Ltd.
| Capacity | 10x10=100 PCS |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Payment Terms | T/T |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Warpage | Warpage MAX 0.21mm |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.8×50.8×4 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Reusable | Yes |
| Packing Level | Transport package |
| Tray Shape | Rectangular |
| Mold Type | Injection |
| Clean Class | General And Ultrasonic Cleaning |
| Supply Ability | 2000PCS/Day |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Cavity Size | 1.57x0.98x0.41 mm |
| Color | Black |
| Model Number | HN24187 |
| Brand Name | Hiner-pack |
| Place of Origin | China |
| Certification | ROHS, ISO |
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Product Specification
| Capacity | 10x10=100 PCS | Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET | Payment Terms | T/T |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Warpage | Warpage MAX 0.21mm |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Outline Line Size | 50.8×50.8×4 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Reusable | Yes |
| Packing Level | Transport package | Tray Shape | Rectangular |
| Mold Type | Injection | Clean Class | General And Ultrasonic Cleaning |
| Supply Ability | 2000PCS/Day | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Cavity Size | 1.57x0.98x0.41 mm | Color | Black |
| Model Number | HN24187 | Brand Name | Hiner-pack |
| Place of Origin | China | Certification | ROHS, ISO |
| High Light | ESD-Safe IC Chip Tray ，Precision Cavity Waffle Pack Tray ，Reusable Semiconductor Tray | ||
Deliver precision cavity structure to hold delicate IC chips firmly, preventing shifting and electrostatic damage during handling. Built with durable material for consistent performance in industrial environments. Provide reliable ESD protection for sensitive semiconductor components. Seeking secure trays for safe chip storage?
Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in chip loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.
Support fully customized cavity size and layout to match specific chip dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect IC chips throughout transit.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×4 mm | ||
| Matrix QTY | 10x10=100 PCS | ||
| Service | Accept OEM, ODM | ||
Also used for finished IC inventory storage, inter-plant component transport, and international shipping of electrostatic-sensitive devices. Serve semiconductor fabs, OSATs, and global electronic component distributors.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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