Shenzhen Hiner Technology Co., Ltd.
| Mold Type | Injection |
| Capacity | 8×16=128 PCS |
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 3.28×6.64×1.28 mm |
| Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Clean Class | General And Ultrasonic Cleaning |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.22mm |
| Outline Line Size | 101.6×101.6×7.28 mm |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25197 |
| Place of Origin | China |
| Certification | ROHS, ISO |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Mold Type | Injection | Capacity | 8×16=128 PCS |
| Payment Terms | T/T | Color | Black |
| Cavity Size | 3.28×6.64×1.28 mm | Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Clean Class | General And Ultrasonic Cleaning | Packing Level | Transport package |
| Warpage | Warpage MAX 0.22mm | Outline Line Size | 101.6×101.6×7.28 mm |
| Reusable | Yes | Packaging Details | CARTON, PALLET |
| Model Number | HN25197 | Place of Origin | China |
| Certification | ROHS, ISO | Brand Name | Hiner-pack |
| High Light | anti static waffle chip tray ，semiconductor storage chip tray ，PC waffle pack tray | ||
These trays fit perfectly into ESD-controlled workshops and automatic production lines. They support high-precision chip processing, component sorting, device testing and internal factory transfer. Reliable performance makes them a common choice for IC packaging factories and electronic component suppliers.
Custom modifications are available to meet unique project needs. Cavity size, spacing, layout and outer dimensions can be adjusted according to chip specifications and automation equipment. Tailored designs help optimize packaging efficiency and keep chips safe throughout storage and transit.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 101.6×101.6×7.28 mm | ||
| Matrix QTY | 8×16=128 PCS | ||
| Service | Accept OEM, ODM | ||
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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