Shenzhen Hiner Technology Co., Ltd.
| Tray Shape | Rectangular |
| Payment Terms | T/T |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Mold Type | Injection |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Warpage | Warpage MAX 0.25mm |
| Delivery Time | 10 workdays |
| Reusable | Yes |
| Packing Level | Transport package |
| Capacity | 21×23=483 PCS |
| Cavity Size | 1.1014×1.412×0.3 mm |
| Supply Ability | 2000PCS/Day |
| Color | Usually black |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET |
| Model Number | HN26001 |
| Place of Origin | China |
| Certification | ROHS, ISO |
| Brand Name | Hiner-pack |
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Product Specification
| Tray Shape | Rectangular | Payment Terms | T/T |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Mold Type | Injection |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Warpage | Warpage MAX 0.25mm |
| Delivery Time | 10 workdays | Reusable | Yes |
| Packing Level | Transport package | Capacity | 21×23=483 PCS |
| Cavity Size | 1.1014×1.412×0.3 mm | Supply Ability | 2000PCS/Day |
| Color | Usually black | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Packaging Details | CARTON, PALLET |
| Model Number | HN26001 | Place of Origin | China |
| Certification | ROHS, ISO | Brand Name | Hiner-pack |
| High Light | Waffle Pack Chip Trays for Testing ，Semiconductor Component Waffle Trays ，Waffle Pack Trays for Sorting | ||
Stabilize chips reliably during test and sorting operations. Lock ICs firmly inside neatly arranged cavities. Reduce slip risks and surface scratches from repeated handling. Enable smooth automated pick and place along production lines.
Built with high rigidity PC raw material. Offer stable conductive static control. Dense uniform cavity layout accommodates large batches of chips. Resist bending under stacking pressure, maintain consistent performance inside cleanroom environments.
Support tailor-made cavity layout and outer dimensions. Adapt to different IC shapes and test fixture requirements. Provide sample validation before mass production. Meet special turnover and storage demands for electronic manufacturing plants.
| Brand | Hiner-pack | ||
| Color | Usually black | ||
| Outline Line Size | 101.6×101.6×5.2 mm | ||
| Matrix QTY | 21×23=483 PCS | ||
| Service | Accept OEM, ODM | ||
Match semiconductor automated test and sorting workflows. Keep ICs stable during inspection and grading. Fit cleanroom mass production stations.
Serve chip circulation and intermediate storage. Protect components from collision when transferring across production processes. Reduce rejects caused by shifting parts.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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