Shenzhen Hiner Technology Co., Ltd.
| Mold Type | Injection |
| Capacity | 10×11=110 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 7.0×6.0×1.1 mm |
| Tray Shape | Rectangular |
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Clean Class | General And Ultrasonic Cleaning |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.23mm |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Outline Line Size | 101.6×101.6×5.5 mm |
| Model Number | HN25264 |
| Place of Origin | China |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
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Product Specification
| Mold Type | Injection | Capacity | 10×11=110 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Payment Terms | T/T |
| Color | Black | Cavity Size | 7.0×6.0×1.1 mm |
| Tray Shape | Rectangular | Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Clean Class | General And Ultrasonic Cleaning |
| Packing Level | Transport package | Warpage | Warpage MAX 0.23mm |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Reusable | Yes |
| Packaging Details | CARTON, PALLET | Outline Line Size | 101.6×101.6×5.5 mm |
| Model Number | HN25264 | Place of Origin | China |
| Brand Name | Hiner-pack | Certification | ROHS, ISO |
| High Light | Static Dissipative ABS Waffle Pack ，ABS Waffle Pack Chip Trays ，Semiconductor Chip Protection Trays | ||
Looking for dependable carriers to protect delicate semiconductor chips? Lock chips steadily within neatly molded cavities. Lower static hazards and surface wear through testing and movement. Prevent component displacement on production workflows.
Built from tough ABS with static dissipative function. Print dimension specs and PIN1 orientation marks on tray surface. Adapt to automated pick and test operations. Keep stable anti-static effect in cleanroom environments.
Allow adjustments to cavity size and overall shape. Accommodate varied chip sizes and project demands. Welcome sample validation and mass production orders. Satisfy unique packaging needs for electronic manufacturers.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 101.6×101.6×5.5 mm | ||
| Matrix QTY | 10×11=110 PCS | ||
| Service | Accept OEM, ODM | ||
Work for semiconductor sorting and testing flows. Hold IC parts safely during inspection and transfer. Deliver stable performance within cleanroom production lines.
Used for electronic component inventory storage. Protect chips through long distance transport. Preserve part condition before final assembly.
Pack trays inside anti-static bags then export cartons. Add separating layers to prevent rubbing and scratches. Print shipping labels clearly on cartons. Work with DHL FedEx UPS and other logistics partners. Support FOB EXW FCA trade terms. Track shipments after dispatch and share delivery updates timely for buyers
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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