Shenzhen Hiner Technology Co., Ltd.
| Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Warpage | Warpage MAX 0.25mm |
| Payment Terms | T/T |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Mold Type | Injection |
| Delivery Time | 10 workdays |
| Reusable | Yes |
| Capacity | 8×16=128 PCS |
| Cavity Size | 3.15×6.5×1.28 mm |
| Supply Ability | 2000PCS/Day |
| Color | Usually black |
| Packing Level | Transport package |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET |
| Model Number | HN25252 |
| Place of Origin | China |
| Certification | ROHS, ISO |
| Brand Name | Hiner-pack |
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Product Specification
| Tray Shape | Rectangular | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Warpage | Warpage MAX 0.25mm | Payment Terms | T/T |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Mold Type | Injection |
| Delivery Time | 10 workdays | Reusable | Yes |
| Capacity | 8×16=128 PCS | Cavity Size | 3.15×6.5×1.28 mm |
| Supply Ability | 2000PCS/Day | Color | Usually black |
| Packing Level | Transport package | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Packaging Details | CARTON, PALLET |
| Model Number | HN25252 | Place of Origin | China |
| Certification | ROHS, ISO | Brand Name | Hiner-pack |
| High Light | Durable Waffle Pack Chip Trays ，Waffle Pack Trays For Semiconductor Handling ，Safe Semiconductor Component Waffle Trays | ||
Looking for sturdy carriers to guard fragile semiconductor components? Hold chips firmly inside precisely molded cavities. Lower friction and collision risks during continuous handling. Keep components stable without shifting through testing and sorting steps.
Built with rigid PC material for long repeated use. Feature neat ordered pocket layout. Match automated pick and test equipment smoothly. Maintain consistent anti static performance in cleanroom working environments.
Support custom cavity shape and dimension adjustment. Modify layout to fit unique chip specifications. Adapt to small trial orders and large volume manufacturing demands. Satisfy varied packaging needs from electronic factories.
| Brand | Hiner-pack | ||
| Color | Usually black | ||
| Outline Line Size | 101.6×101.6×7.28 mm | ||
| Matrix QTY | 8×16=128 PCS | ||
| Service | Accept OEM, ODM | ||
Serve semiconductor assembly and chip testing lines. Secure IC units during inspection and sorting. Enable smooth circulation inside cleanroom workshops.
Support electronic component warehouse storage. Protect chips during batch outbound shipment. Keep parts intact before final packaging.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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