Shenzhen Hiner Technology Co., Ltd.
| Color | Black |
| Payment Terms | T/T |
| Mold Type | Injection |
| Packing Level | Transport package |
| Delivery Time | 10 workdays |
| Cavity Size | 11.55×12.85×6.45 mm |
| Tray Shape | Rectangular |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Warpage | Warpage MAX 0.23mm |
| Supply Ability | 2000PCS/Day |
| Reusable | Yes |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Outline Line Size | 101.6×101.6×7 mm |
| Capacity | 3×4=12 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET |
| Clean Class | General And Ultrasonic Cleaning |
| Model Number | HN25227 |
| Place of Origin | China |
| Certification | ROHS, ISO |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Color | Black | Payment Terms | T/T |
| Mold Type | Injection | Packing Level | Transport package |
| Delivery Time | 10 workdays | Cavity Size | 11.55×12.85×6.45 mm |
| Tray Shape | Rectangular | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Warpage | Warpage MAX 0.23mm | Supply Ability | 2000PCS/Day |
| Reusable | Yes | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Outline Line Size | 101.6×101.6×7 mm | Capacity | 3×4=12 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details | CARTON, PALLET | Clean Class | General And Ultrasonic Cleaning |
| Model Number | HN25227 | Place of Origin | China |
| Certification | ROHS, ISO | Brand Name | Hiner-pack |
| High Light | Solid PC waffle pack chip trays ，ESD protection semiconductor chip trays ，Precision grid waffle chip trays | ||
Fabricated from rigid PC material with static dissipative property. Precision shaped cavities firmly lock components and avoid shifting during handling. Smooth surface cuts abrasion risk for fragile semiconductor units. Looking for reliable carriers for automated testing lines? Stable ESD performance effectively prevent electrostatic damage.
Fit automatic test equipment and controlled ESD work zones. Support component sorting inspection and batch transfer. Secure parts all the way from loading to final packing. Gain trust from semiconductor assembly factories.
Have special component outline requirements? Custom cavity shape marking and tray dimension available. Flexible designs match unique automation processes for non-standard parts.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 101.6×101.6×7 mm | ||
| Matrix QTY | 3×4=12 PCS | ||
| Service | Accept OEM, ODM | ||
Suit semiconductor component testing sorting and inspection. Compatible with automatic pick and place machines inside cleanroom environments.
Work well for batch component storage in-house circulation and transit. Widely adopted by semiconductor assembly and electronic manufacturing plants.
Protective outer packing absorb impact during shipment. Multiple shipping modes satisfy different delivery schedules.
Real-time tracking available for cargo status. Goods carefully packed to avoid deformation and scratches before dispatch to destinations worldwide.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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