Shenzhen Hiner Technology Co., Ltd.
| Delivery Time | 10 workdays |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.23mm |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Outline Line Size | 101.6×101.6×7 mm |
| Mold Type | Injection |
| Capacity | 4×7=28 PCS |
| Payment Terms | T/T |
| Color | Black |
| Cavity Size | 20.25×10×0.1 mm |
| Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Place of Origin | China |
| Certification | ROHS, ISO |
| Model Number | HN25249 |
| Brand Name | Hiner-pack |
View Detail Information
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Product Specification
| Delivery Time | 10 workdays | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Packing Level | Transport package |
| Warpage | Warpage MAX 0.23mm | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Outline Line Size | 101.6×101.6×7 mm | Mold Type | Injection |
| Capacity | 4×7=28 PCS | Payment Terms | T/T |
| Color | Black | Cavity Size | 20.25×10×0.1 mm |
| Tray Shape | Rectangular | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Reusable | Yes | Packaging Details | CARTON, PALLET |
| Place of Origin | China | Certification | ROHS, ISO |
| Model Number | HN25249 | Brand Name | Hiner-pack |
| High Light | Solid PC Waffle Pack Chip Trays ，ESD Protection Waffle Pack Trays ，Precision Engineered Chip Trays | ||
Searching for reliable carrier for fragile IC parts? Hold tiny chips firmly inside neatly molded cavities. Block static charge buildup and avoid sudden electrostatic harm across production links. Keep every single component fixed without shifting during movement.
Feature rigid flat panel design with evenly arranged pockets. Fit automated test fixtures and pick place equipment perfectly. Cut abrasion and collision risk during repeated handling, inspection and transfer. Maintain consistent performance after long time circulation.
Accept custom cavity shapes depths and overall tray dimensions. Adjust layout to match unique chip outlines and footprint. Support small batch and mass production projects. Meet diverse requirements from electronic and semiconductor manufacturers.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 101.6×101.6×7.8 mm | ||
| Matrix QTY | 4×7=28 PCS | ||
| Service | Accept OEM, ODM | ||
Support semiconductor production and chip testing workflows. Carry ICs while sorting and quality checking. Enable smooth part circulation inside workshops and assembly lines.
Fit electronic parts warehouse keeping. Support bulk chip outbound transport. Preserve component integrity before final assembly and packaging.
Pack inside anti static bags then export cartons. Proper stacking avoid surface marks. Provide various shipping choices. Track shipments after sending. Ensure safe arrival to worldwide clients.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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