Shenzhen Hiner Technology Co., Ltd.
| Delivery Time | 10 workdays |
| Reusable | Yes |
| Cavity Size | 10.36×12.36×1.00 mm |
| Supply Ability | 2000PCS/Day |
| Color | Usually black |
| Packing Level | Transport package |
| Capacity | 6×7-1=41 PCS |
| Tray Shape | Rectangular |
| Payment Terms | T/T |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Mold Type | Injection |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Warpage | Warpage MAX 0.25mm |
| Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Place of Origin | China |
| Model Number | HN25211 |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
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Product Specification
| Delivery Time | 10 workdays | Reusable | Yes |
| Cavity Size | 10.36×12.36×1.00 mm | Supply Ability | 2000PCS/Day |
| Color | Usually black | Packing Level | Transport package |
| Capacity | 6×7-1=41 PCS | Tray Shape | Rectangular |
| Payment Terms | T/T | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Mold Type | Injection | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Warpage | Warpage MAX 0.25mm | Clean Class | General And Ultrasonic Cleaning |
| Packaging Details | CARTON, PALLET | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Place of Origin | China | Model Number | HN25211 |
| Brand Name | Hiner-pack | Certification | ROHS, ISO |
| High Light | ESD waffle pack chip trays ，cleanroom contamination control trays ，IC protection waffle trays | ||
Precision grid cavities separate single chips and reduce friction damage during frequent handling. Reliable static dissipative material protects fragile semiconductor dies from ESD surge. Looking for stable component protection for cleanroom production? Solid shielding effectively cut reject rate in chip processing.
Match automatic test machines and ESD controlled work areas. Enable chip sorting electrical check and cross workshop transfer. Secure parts all the way from loading to final packaging. Earn consistent recognition from IC packaging factories.
Have special chip dimension requirements? Custom solutions adjust pocket size marking and tray outline. Flexible layouts adapt to different automation lines and fit non standard components.
| Brand | Hiner-pack | ||
| Color | Usually black | ||
| Outline Line Size | 101.6×101.6×8 mm | ||
| Matrix QTY | 6×7-1=41 PCS | ||
| Service | Accept OEM, ODM | ||
Fit semiconductor IC testing sorting and precision inspection. Work well with automatic pick and place equipment inside cleanroom environments.
Great for short term chip storage internal logistics and component packing. Popular among semiconductor packaging and electronic component makers.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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